Abstract: An electro-optical device includes a plurality of scanning lines that extends in a row direction, a plurality of data lines that extends in a column direction, a plurality of pixels which are provided at intersections of the scanning lines and the data lines and whose gray-scale levels are designated by data signals supplied through the data lines, a common electrode that is provided so as to be opposite to pixel electrodes, a shift register that outputs sampling signals to sequentially select a plurality of blocks each composed of a plurality of the data lines, in a period where the scanning lines are selected, a sampling circuit that samples the data signals to the plurality of data lines belonging to the block selected by the sampling signal, respectively, a data signal supply circuit that changes the potential of the data signal into a higher level and a lower level than a predetermined potential in every predetermined period and then alternately outputs the potentials, and a correction circuit that super

Abstract: The invention provides an electrooptic device that can include a first substrate on which pixel electrodes, first thin film transistors electrically connected to the pixel electrodes, and scanning lines and data lines electrically connected to the first thin film transistors are formed, a second substrate opposing the first substrate and having a common electrode, and an electrooptic substance held between the first substrate and the second substrate. The electrooptical device can further include a switching element for discharging in capacitors constituted by the pixel electrodes on the first substrate, the electrooptic substance, and the common electrode on the second substrate. The invention makes it possible to remove charges from inside the electrooptic device.

Abstract: An electro-optical device includes a plurality of scanning lines that extends in a row direction, a plurality of data lines that extends in a column direction, a plurality of pixels which are provided at intersections of the scanning lines and the data lines and whose gray-scale levels are designated by data signals supplied through the data lines, a common electrode that is provided so as to be opposite to pixel electrodes, a shift register that outputs sampling signals to sequentially select a plurality of blocks each composed of a plurality of the data lines, in a period where the scanning lines are selected, a sampling circuit that samples the data signals to the plurality of data lines belonging to the block selected by the sampling signal, respectively, a data signal supply circuit that changes the potential of the data signal into a higher level and a lower level than a predetermined potential in every predetermined period and then alternately outputs the potentials, and a correction circuit that super

Abstract: The invention provides an electrooptic device that can include a first substrate on which pixel electrodes, first thin film transistors electrically connected to the pixel electrodes, and scanning lines and data lines electrically connected to the first thin film transistors are formed, a second substrate opposing the first substrate and having a common electrode, and an electrooptic substance held between the first substrate and the second substrate. The electrooptical device can further include a switching element for discharging in capacitors constituted by the pixel electrodes on the first substrate, the electrooptic substance, and the common electrode on the second substrate. The invention makes it possible to remove charges from inside the electrooptic device.

Abstract: A circuit substrate for use in manufacturing integrated circuit devices by the strip-support method in connection with a semiconductor element having conductive pads. The circuit substrate includes a base layer, a conductive circuit layer supported on the base layer for mechanically and electrically coupling to the conductive pads of a semiconductor device. The conductive circuit layer includes a plurality of finger leads with a bump at the end of each finger lead for mechanically and electrically coupling to one of the conductive pads. The coupling surface of each bump has a roughness in a range between 5 and 20 microns. The inherent roughness of the bumps can be augmented by plating the bumps with nickel and gold. A method for forming bumps on the conductive layer of a circuit substrate for attachment of the circuit substrate to conductive pads of a semiconductor element is also provided. The method includes coating a front and a back surface of the conductive layer with photo-resists.