Abstract: A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

Abstract: A light emitting diode is provided which includes a circuit substrate, a semi-spherical concave surface part formed in the circuit substrate, and a transparent stage disposed in the semi-spherical concave surface part in the circuit substrate. An LED chip is mounted on the horizontal upper surface of the transparent stage, a reflective member forms a truncated cone-shaped concave surface part disposed to be joined to an end of the semi-spherical concave surface part and attached on the substrate. A sealing body is disposed in the joined concave surface parts to cover the LED chip. The transparent stage includes a lower surface having a convex surface corresponding to a concave surface of the semi-spherical concave surface part and an upper surface formed in a horizontal surface. The LED chip is mounted on the horizontal upper surface of the transparent stage.

Abstract: The LED comprises: a base having high thermal conductivity and having a mounting surface for die bonding; a printed circuit board mounted on the base and having a hole to expose a part of the mounting surface of the base and having a protruding portion projecting horizontally outward on the outer periphery of the base; an LED element mounted on the mounting surface of the base exposed in the hole of the printed circuit board; and a resin material sealing the LED element from above; wherein through-holes electrically connected to the LED element are formed at the outer periphery of the protruding portion and an external connection electrode is provided to the upper and lower surfaces of the through-holes. This LED enhances the heat dissipating effect to enable generation of high-luminance light and can also be mounted on either the upper or lower surface of a motherboard.

Abstract: An LED comprising a circuit board, a first electrode unit provided on a first surface of the circuit board, a second electrode unit provided on a second surface of the circuit board and electrically connected to the first electrode unit, an LED element mounted on the first electrode unit, and a resinous body bonded to the circuit board to seal the LED element and the first electrode unit, the first electrode unit positioned within the bonding surface of the circuit board and the resinous body.

Abstract: An insulating substrate made of insulating material is used. A pair of electrode patterns are formed on the surface of the insulating substrate, and a pair of through-holes are formed in the insulating substrate. A resin is mounted on the insulating substrate to close an opening of each of the through-holes. Two portions of the resin are removed to form a pair of electric conduction parts necessary for mounting an LED element.

Abstract: A light emitting diode, comprising a circuit substrate, an LED chip, a heat radiating mechanism provided on said circuit substrate and supporting said LED chip to receive heat from the LED chip and radiate the heat, and a sealing body provided on said circuit substrate to cover said LED chip

Abstract: A light emitting diode, including a circuit substrate, a reflective member attached on the circuit substrate, a semi-spherical concave surface part formed in the circuit substrate, a truncated cone-shape concave surface part formed in the reflective member and disposed to continue to the semi-spherical concave surface part, a transparent stage disposed in the semi-spherical concave surface part of the circuit substrate, an LED chip mounted on the transparent stage, and a sealing body disposed in the semi-spherical concave surface part and the truncated cone-shape concave surface part to cover the LED chip.

Abstract: A surface-mounted LED including a base having heat conductivity, an insulative wiring board fixed to the base and including a conductive pattern and a mounting hole, a light emitting element chip mounted on a mounting area exposed by the mounting hole of the wiring board, and a reflective frame having heat conductivity and fixed to the base and thermally coupled therewith, to surround the light emitting element chip, heat generation from the light emitting element chip being released through both the base and the reflective frame, or either one thereof.

Abstract: A light emitting element has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting chip is secured to the base at an exposed mounting area. The light emitting chip is electrically connected to the conductive patterns.

Abstract: A light emitting diode is disclosed which can enhance the scattering of light produced by a light emitting element to improve a brightness not only at an upper surface but also at side surfaces of a resin sealant covering the light emitting element, thereby providing a high brightness level in a wider range of angle. This light emitting diode comprises a substrate 22, a pair of electrodes 23a, 23b provided on the substrate, a light emitting element 24 mounted on the substrate and electrically connected to the electrodes, a sealant 26 provided on the substrate to seal the electrodes 23a, 23b and the light emitting element 24; and a light scattering layer 30 formed on an outermost layer of a light projecting surface 27 of the sealant 26.

Abstract: A light emitting diode according to the present invention comprises an element substrate, a light emitting element mounted on said element substrate, a sealing body which emits light from the light emitting element and which seals said light emitting element, and a light shielding means to form light emitting parts for directing light from the sealing body in two dimensional directions which are formed from a combination of either two axes of three dimensional axes X, Y and Z. The light shielding means causes one portion of the light emitting parts to light emit and the other of the light emitting parts to light shield.

Abstract: A light emitting diode is disclosed which can enhance the scattering of light produced by a light emitting element to improve a brightness not only at an upper surface but also at side surfaces of a resin sealant covering the light emitting element, thereby providing a high brightness level in a wider range of angle.