Patents by Inventor Sadayuki Nagashima

Sadayuki Nagashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printing screen cleaning method and apparatus
    Patent number: 7032513
    Abstract: A printing screen cleaning apparatus and a method for cleaning a printing screen by employing the cleaning apparatus which includes a cleaning head having a wiping member and a backup member for sucking the paste via a wiping member while sliding the wiping member on a lower surface of the printing screen. The backup member includes a suction port provided in a suction region of a backup surface of the backup member. The backup member also has a groove that extends parallel to the suction region and approximately perpendicular to the sliding direction of the wiping member. The groove partially releases the backup of the wiping member.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: April 25, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Onishi, Toshinori Mimura, Naoichi Chikahisa, Ken Takahashi, Toshiyuki Murakami, Hitoshi Nakahira, Sadayuki Nagashima
  • Solder paste printing apparatus and printing method
    Patent number: 6935232
    Abstract: When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: August 30, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Onishi, Toshinori Mimura, Naoichi Chikahisa, Ken Takahashi, Toshiyuki Murakami, Hitoshi Nakahira, Sadayuki Nagashima
  • Solder paste printing apparatus and printing method
    Patent number: 6923117
    Abstract: When solder paste passes through a first gap located between a pressurizing member and a printing mask during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: August 2, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroaki Onishi, Toshinori Mimura, Naoichi Chikahisa, Ken Takahashi, Toshiyuki Murakami, Hitoshi Nakahira, Sadayuki Nagashima
  • Solder past printing apparatus and printing method
    Publication number: 20040108368
    Abstract: When solder paste passes through a first gap (34) located between a pressurizing member (28) and a printing mask (3) during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
    Type: Application
    Filed: August 15, 2003
    Publication date: June 10, 2004
    Inventors: Hiroaki Onishi, Toshinori Mimura, Naoichi Chikahisa, Ken Takahashi, Toshiyuki Murakami, Hitoshi Nakahira, Sadayuki Nagashima
  • Solder paste printing apparatus and printing method
    Publication number: 20040035306
    Abstract: When solder paste passes through a first gap (34) located between a pressurizing member (28) and a printing mask (3) during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.
    Type: Application
    Filed: August 15, 2003
    Publication date: February 26, 2004
    Inventors: Hiroaki Onishi, Toshinori Mimura, Naoichi Chikahisa, Ken Takahashi, Toshiyuki Murakami, Hitoshi Nakahira, Sadayuki Nagashima