Abstract: A flame-retardant reinforced polyamide resin composition comprising (a) a half-aromatic polyamide resin having a hexamethylene adipamide unit and a hexamethylene isophthalamide unit, (b) a melamine polyphosphate and (c) an inorganic reinforcing material, and, if necessary, (d) a polyalkylene polyhydric alcohol and/or a fatty acid ester derivative thereof, (e) a bisamide compound, (f) a metal oxide and/or a molybdate, and (g) a metal salt of a higher fatty acid having 10-25 carbon atoms. According to the composition of the present invention, molding materials can be provided which are very high in flame retardancy even when they are molded into thin-wall moldings, do not generate corrosive hydrogen halide gases during burning and, furthermore, have both excellent electric characteristics and excellent molding processability.

Abstract: A flame-retardant reinforced polyamide resin composition comprising (a) a half-aromatic polyamide resin having a hexamethylene adipamide unit and a hexamethylene isophthalamide unit, (b) a melamine polyphosphate and (c) an inorganic reinforcing material, and, if necessary, (d) a polyalkylene polyhydric alcohol and/or a fatty acid ester derivative thereof, (e) a bisamide compound, (f) a metal oxide and/or a molybdate, and (g) a metal salt of a higher fatty acid having 10-25 carbon atoms. According to the composition of the present invention, molding materials can be provided which are very high in flame retardancy even when they are molded into thin-wall moldings, do not generate corrosive hydrogen halide gases during burning and, furthermore, have both excellent electric characteristics and excellent molding processability.

Abstract: A polyamide composition comprising an aromatic ring-containing polyamide resin and a specific amount of an aliphatic polyester. The composition has improved molding properties, such as mold release characteristics, and exhibits excellent physical properties, such as stiffness, which will not be lowered upon contact with moisture. The polyamide composition may contain additional components which have been used to improve properties other than molding properties, such as Izod impact strength and hinge effect properties, so that the effects of the components are also exerted in the present composition without sacrificing the main effect aimed at by the present invention, i.e., excellent molding properties. Therefore, the polyamide composition of the present invention is useful as a molding material in various fields, e.g., automobile, electrical and electronic industries.