Patents by Inventor Sadia Arefin Khan

Sadia Arefin Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230412431
    Abstract: A multi-channel digital isolator includes a digital isolator and an interlock circuit. The isolator includes a transmitter having a transmitter output, a receiver having a receiver input and a receiver output, an isolation barrier coupled between the transmitter output and the receiver input, and an output buffer having a buffer input and configured to output an isolated signal. The transmitter is configured to transmit an input signal across the isolation barrier. The interlock circuit has an interlock input coupled to the receiver output and an interlock output coupled to the buffer input. The interlock module is configured to prevent overlapping active states between the first isolated signal and a complementary isolated signal. In some implementations, the digital isolator also includes a dead-time insertion circuit.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Sadia Arefin KHAN, Anant Shankar KAMATH, Martin STAEBLER, Vikas Kumar THAWANI
  • Patent number: 11792051
    Abstract: A multi-channel digital isolator includes a digital isolator and an interlock circuit. The isolator includes a transmitter having a transmitter output, a receiver having a receiver input and a receiver output, an isolation barrier coupled between the transmitter output and the receiver input, and an output buffer having a buffer input and configured to output an isolated signal. The transmitter is configured to transmit an input signal across the isolation barrier. The interlock circuit has an interlock input coupled to the receiver output and an interlock output coupled to the buffer input. The interlock module is configured to prevent overlapping active states between the first isolated signal and a complementary isolated signal. In some implementations, the digital isolator also includes a dead-time insertion circuit.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: October 17, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Sadia Arefin Khan, Anant Shankar Kamath, Martin Staebler, Vikas Kumar Thawani
  • Publication number: 20220021562
    Abstract: A multi-channel digital isolator includes a digital isolator and an interlock circuit. The isolator includes a transmitter having a transmitter output, a receiver having a receiver input and a receiver output, an isolation barrier coupled between the transmitter output and the receiver input, and an output buffer having a buffer input and configured to output an isolated signal. The transmitter is configured to transmit an input signal across the isolation barrier. The interlock circuit has an interlock input coupled to the receiver output and an interlock output coupled to the buffer input. The interlock module is configured to prevent overlapping active states between the first isolated signal and a complementary isolated signal. In some implementations, the digital isolator also includes a dead-time insertion circuit.
    Type: Application
    Filed: June 21, 2021
    Publication date: January 20, 2022
    Inventors: Sadia Arefin KHAN, Anant Shankar KAMATH, Martin STAEBLER, Vikas Kumar THAWANI
  • Patent number: 10147672
    Abstract: An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled to the set of leads. Encapsulating material encloses the semiconductor die, such that the set of pins extend beyond the encapsulating material. An additive coating covers one or more of the plurality of pins.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: December 4, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yong Lin, Sadia Arefin Khan, Benjamin Stassen Cook
  • Publication number: 20170309553
    Abstract: An integrated circuit (IC) includes a lead frame that has a set of leads coupled to a corresponding set of pins. A semiconductor die with contacts is coupled to the set of leads. Encapsulating material encloses the semiconductor die, such that the set of pins extend beyond the encapsulating material. An additive coating covers one or more of the plurality of pins.
    Type: Application
    Filed: April 20, 2016
    Publication date: October 26, 2017
    Inventors: Yong Lin, Sadia Arefin Khan, Benjamin Stassen Cook