Patents by Inventor Sae Rom NAM

Sae Rom NAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermosetting resin composition, and prepreg and substrate using same
    Patent number: 10774173
    Abstract: The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: September 15, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Hee Jin Cho, Do Kyung Sung, Sae Rom Nam
  • Benzoxazine-based mixture and use thereof
    Patent number: 10766887
    Abstract: The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: September 8, 2020
    Assignee: KOLON INDUSTRIES, INC.
    Inventors: Sae Rom Nam, Do Kyung Sung, Hee Jin Cho
  • BENZOXAZINE-BASED MIXTURE AND USE THEREOF
    Publication number: 20190169177
    Abstract: The present invention relates to a benzoxazine-based mixture and a use thereof and, more specifically, to a benzoxazine-based mixture and a use of a cured product in which the benzoxazine-based mixture is cured, wherein the benzoxazine-based mixture has high dielectric characteristics, heat resistant characteristics, and flame-retardant characteristics by comprising a benzoxazine ring in a molecular structure, and thus can be applied to a sealing material, a molding material, a template material, an adhesive, a material for an electric insulation paint, and the like, which are used for a copper clad laminate or an electronic part, used in a printed circuit board.
    Type: Application
    Filed: June 30, 2017
    Publication date: June 6, 2019
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Sae Rom NAM, Do Kyung SUNG, Hee Jin CHO
  • THERMOSETTING RESIN COMPOSITION, AND PREPREG AND SUBSTRATE USING SAME
    Publication number: 20190153151
    Abstract: The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.
    Type: Application
    Filed: June 29, 2017
    Publication date: May 23, 2019
    Applicant: KOLON INDUSTRIES, INC.
    Inventors: Hee Jin CHO, Do Kyung SUNG, Sae Rom NAM