Patents by Inventor Saeed Sayed

Saeed Sayed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heatsink attachment mechanism
    Patent number: 7492598
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: February 17, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar
  • HEATSINK ATTACHMENT MECHANISM
    Publication number: 20080068809
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar