Abstract: A vacuum pressure furnace and/or a cooling plate for a vacuum pressure furnace is described, having a cooling channel or tube that selectively circulates a liquid coolant at a reduced temperature. The cooling channel “snakes” back and forth through a target plate assembly to conduct heat from the target plate assembly and back to the coolant. The target plate assembly includes a plurality of clamp members that are screwed over portions of the cooling channel and to a bottom of a plate member of the assembly, enclosing portions of the cooling channel. Thermal sheets or foil are wrapped around the cooling channel, thereby bridging any gaps between the components that may occur during temperature changes due to thermal expansion/contraction.

Abstract: An embodiment of the present invention is a technique to automate transfer of parts for high throughput. A boat transfer unit (BTU) arm carrying a boat containing a plurality of parts is rotated from an initial position to a first position that is below a process chamber. The BTU arm engages a boat support that supports the boat. The BTU arm is moved upward to a second position such that the boat partially enters the process chamber at a distance D with respect to an entrance opening of the process chamber. An elevator arm carrying a pedestal is engaged to lower side of the boat support. The BTU arm is moved away from the second position. The elevator arm is moved upward to fully insert the boat inside the process chamber.

Abstract: A thermal processing apparatus is disclosed which separates the load bearing components from the thermal components, improving heating time, cooling time, thermal response, and energy efficiency. The thermal processing apparatus comprises an array of cylindrical heating elements which rest on support plates of high temperature, low density material. The support plates and heating elements are then supported by a rigid skeletal structure for load bearing support.

Abstract: An embodiment of the invention is a technique to generate warning of a failure of a heating element. An operational value of at least one of operating parameters of the heating element in a heater zone of a heating unit is monitored. A remaining life value of the at least one of the operating parameters is estimated. A warning is generated if the operational value exceeds a threshold value relative to the remaining life value.

Abstract: An embodiment of the present invention is a technique to automate transfer of parts for high throughput. A boat transfer unit (BTU) arm carrying a boat containing a plurality of parts is rotated from an initial position to a first position that is below a process chamber. The BTU arm engages a boat support that supports the boat. The BTU arm is moved upward to a second position such that the boat partially enters the process chamber at a distance D with respect to an entrance opening of the process chamber. An elevator arm carrying a pedestal is engaged to lower side of the boat support. The BTU arm is moved away from the second position. The elevator arm is moved upward to fully insert the boat inside the process chamber.

Abstract: An embodiment of the present invention is a heating element structure. A first strip wire shaped in a wave-like configuration is attached to an insulator surface by a plurality of staples placed along the first strip wire.

Abstract: An embodiment of the present invention is a heating element structure. A first tray has an inner boundary and an outer boundary. The inner and outer boundaries define a space. A first heating element fit to the first tray and surrounding the inner boundary generates heat when power is applied. The heating element expands in the space within a temperature range.

Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.

Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.