Patents by Inventor Saeed Shafiyan-Rad
Saeed Shafiyan-Rad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230360990Abstract: A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.Type: ApplicationFiled: August 8, 2022Publication date: November 9, 2023Applicant: Microchip Technology IncorporatedInventors: Saeed Shafiyan-Rad, Evan Kirk, David Doiron, Christopher Alan Barnes
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Patent number: 11721600Abstract: A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal. A ceramic seal surrounding the at least one high-current I/O terminal is hermetically bonded to an outer surface of the package body. A metal hermetic seal washer surrounding the at least one high-current I/O terminal is hermetically bonded to the ceramic seal and to a portion of the at least one high-current I/O terminal. A lid is seam welded onto the package body.Type: GrantFiled: December 21, 2020Date of Patent: August 8, 2023Assignee: Microsemi CorporationInventors: Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
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Publication number: 20210159130Abstract: A method for fabricating a hermetic electronic package includes providing a package body; hermetically coupling a package base plate to the package body; thermally coupling a substrate to the base plate; thermally mounting a semiconductor device to the substrate; bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal. A ceramic seal surrounding the at least one high-current I/O terminal is hermetically bonded to an outer surface of the package body. A metal hermetic seal washer surrounding the at least one high-current I/O terminal is hermetically bonded to the ceramic seal and to a portion of the at least one high-current I/O terminal. A lid is seam welded onto the package body.Type: ApplicationFiled: December 21, 2020Publication date: May 27, 2021Applicant: Microsemi CorporationInventors: Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
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Patent number: 10903128Abstract: A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body. A semiconductor device is thermally mounted to the base plate and has a high-current output. A high-current input/output (I/O) terminal is bonded to the high-current output of the semiconductor device by a strap terminal that is an integral high current heatsink terminal. The high-current I/O terminal passes through a hole formed in a sidewall of the package body. A ceramic seal surrounds the high-current I/O terminal and has a first surface hermetically bonded to an outer surface of the sidewall of the package body. A metal hermetic seal washer surrounds the high-current I/O terminal and is bonded to a second surface of the ceramic seal and bonded to a portion of the high-current I/O terminal that passes through the metal hermetic seal washer.Type: GrantFiled: April 3, 2019Date of Patent: January 26, 2021Assignee: Microsemi CorporationInventors: Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
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Publication number: 20200266118Abstract: A hermetic high-current electronic package includes a package body and a base plate hermetically coupled to the package body. A semiconductor device is thermally mounted to the base plate and has a high-current output. A high-current input/output (I/O) terminal is bonded to the high-current output of the semiconductor device by a strap terminal that is an integral high current heatsink terminal. The high-current I/O terminal passes through a hole formed in a sidewall of the package body. A ceramic seal surrounds the high-current I/O terminal and has a first surface hermetically bonded to an outer surface of the sidewall of the package body. A metal hermetic seal washer surrounds the high-current I/O terminal and is bonded to a second surface of the ceramic seal and bonded to a portion of the high-current I/O terminal that passes through the metal hermetic seal washer.Type: ApplicationFiled: April 3, 2019Publication date: August 20, 2020Applicant: Microsemi CorporationInventors: Saeed Shafiyan-Rad, Manuel Medeiros, III, David Scott Doiron
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Patent number: 7675285Abstract: An apparatus includes a sense element and an oscillator. The oscillator is coupled to the sense element and is used to generate an oscillator signal and a gain control signal. The oscillator signal is amplitude compensated when noise is detected in the sense element. A method includes detecting magnetic interference in a sense element coupled to an oscillator, and adjusting a gain control signal in the oscillator to compensate for the magnetic interference.Type: GrantFiled: September 9, 2004Date of Patent: March 9, 2010Assignee: Rockwell Automation Technologies, Inc.Inventors: Weihua Chen, Saeed Shafiyan-Rad
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Patent number: 7274189Abstract: An apparatus includes a first circuit, a second circuit, and a capacitor. The first circuit includes a sense element. The capacitor couples the first circuit to the second circuit. The first feedback path couples the second circuit to the first circuit. And the second feedback path couples the second circuit to the first circuit. A method includes generating, for an oscillator signal having an amplitude and a gain, a substantially direct current signal related to an amplitude, and controlling the gain with the substantially direct current signal.Type: GrantFiled: September 9, 2004Date of Patent: September 25, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Weihua Chen, Saeed Shafiyan-Rad
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Patent number: 7190268Abstract: An indicator apparatus facilitates visibility of one or more indicators from multiple angles. The apparatus includes a housing having an outer sidewall portion. The sidewall portion, for example, has a first side extending between two adjacent sides. One or more elongated slots are formed in the sidewall portion. A substantially translucent material is disposed in the slot so that the translucent material is visible from more than one side of the housing, such as the first side and another side through which the slot extends. A light source is operatively associated with the substantially translucent material for illuminating the material. As a result, when the light source illuminates the substantially translucent material, the illuminated translucent material is visible from more than one side of the housing.Type: GrantFiled: December 19, 2005Date of Patent: March 13, 2007Assignee: Rockwell Automation Technologies, Inc.Inventors: Saeed Shafiyan Rad, Daniel M. Corbosiero, Mark S. Schladenhauffen
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Publication number: 20060061351Abstract: An apparatus includes a sense element and an oscillator. The oscillator is coupled to the sense element and is used to generate an oscillator signal and a gain control signal. The oscillator signal is amplitude compensated when noise is detected in the sense element. A method includes detecting magnetic interference in a sense element coupled to an oscillator, and adjusting a gain control signal in the oscillator to compensate for the magnetic interference.Type: ApplicationFiled: September 9, 2004Publication date: March 23, 2006Inventors: Weihua Chen, Saeed Shafiyan-Rad
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Publication number: 20060049827Abstract: An apparatus includes a first circuit, a second circuit, and a capacitor. The first circuit includes a sense element. The capacitor couples the first circuit to the second circuit. The first feedback path couples the second circuit to the first circuit. And the second feedback path couples the second circuit to the first circuit. A method includes generating, for an oscillator signal having an amplitude and a gain, a substantially direct current signal related to an amplitude, and controlling the gain with the substantially direct current signal.Type: ApplicationFiled: September 9, 2004Publication date: March 9, 2006Inventors: Weihua Chen, Saeed Shafiyan-Rad
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Patent number: 7009525Abstract: An indicator apparatus facilitates visibility of one or more indicators from multiple angles. The apparatus includes a housing having an outer sidewall portion. The sidewall portion, for example, has a first side extending between two adjacent sides. One or more elongated slots are formed in the sidewall portion. A substantially translucent material is disposed in the slot so that the translucent material is visible from more than one side of the housing, such as the first side and another side through which the slot extends. A light source is operatively associated with the substantially translucent material for illuminating the material. As a result, when the light source illuminates the substantially translucent material, the illuminated translucent material is visible from more than one side of the housing.Type: GrantFiled: June 9, 2000Date of Patent: March 7, 2006Assignee: Rockwell Automation Technologies, Inc.Inventors: Saeed Shafiyan-Rad, Daniel M. Corbosiero, Jr., Mark Stephen Schladenhauffen
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Patent number: 6958694Abstract: An indicator apparatus facilitates visibility of one or more indicators from multiple angles. The apparatus includes a housing having an outer sidewall portion. The sidewall portion, for example, has a first side extending between two adjacent sides. One or more elongated slots are formed in the sidewall portion. One or more light sources are positioned within the one or more elongated slots.Type: GrantFiled: September 20, 2002Date of Patent: October 25, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Saeed Shafiyan-Rad, Daniel M. Corbosiero, Jr., Mark Stephen Schladenhauffen
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Patent number: 6940276Abstract: A sensor for measuring a clamp arm position in a power clamp provides a sensor wheel that may fit beneath the clamp arm. A low profile sensor body abuts an edge of the sensory wheel to detect the sensor position without undue change in the power clamp or clearance about the power clamp.Type: GrantFiled: May 13, 2003Date of Patent: September 6, 2005Assignee: Rockwell Automation Technologies, Inc.Inventors: Saeed Shafiyan-Rad, Larry Joseph Fisher, Daniel M. Corbosiero, Jr.
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Publication number: 20040227508Abstract: A sensor for measuring a clamp arm position in a power clamp provides a sensor wheel that may fit beneath the clamp arm. A low profile sensor body abuts an edge of the sensory wheel to detect the sensor position without undue change in the power clamp or clearance about the power clamp.Type: ApplicationFiled: May 13, 2003Publication date: November 18, 2004Inventors: Saeed Shafiyan-Rad, Larry Joseph Fisher, Daniel M. Corbosiero
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Patent number: 6617845Abstract: A housing for a proximity sensor is resistant to harsh environmental effects, such as scorching particles due to sputtering in a welding environment. The sensor housing is formed of a material having a high thermal conductivity, such as copper or an alloy thereof. As a result, the housing is able to rapidly dissipate heat and, in turn, mitigate weld slag build-up so as to improve the efficacy of the sensor.Type: GrantFiled: April 28, 2000Date of Patent: September 9, 2003Assignee: Rockwell Automation Technologies, Inc.Inventors: Saeed Shafiyan-Rad, Isak Kayserman, Larry Joseph Fischer
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Patent number: D446141Type: GrantFiled: June 15, 2000Date of Patent: August 7, 2001Assignee: Rockwell Technologies, LLCInventors: Saeed Shafiyan-Rad, Daniel M. Corbosiero, Jr., Mark Stephen Schladenhauffen
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Patent number: D446142Type: GrantFiled: June 15, 2000Date of Patent: August 7, 2001Assignee: Rockwell Technologies, LLCInventors: Saeed Shafiyan-Rad, Daniel M. Corbosiero, Jr., Mark Stephen Schladenhauffen