Patents by Inventor Saeeun Kim

Saeeun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250166721
    Abstract: A nonvolatile memory device includes at least one first universal interface bus (UIB) circuit coupled to a plurality of input/output (I/O) pads, at least one second UIB circuit coupled to the plurality of I/O pads, a core block including a first input terminal coupled to another block, and a plurality of second input terminals coupled to a first output terminal of the at least one first UIB circuit and a second output terminal of the at least one second UIB circuit, and at least one block configured to activate the at least one second UIB circuit.
    Type: Application
    Filed: July 2, 2024
    Publication date: May 22, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yongha PARK, Seaeun Park, Saeeun Kim
  • Publication number: 20250027992
    Abstract: An integrated circuit may include a plurality of combinational logic circuits including a first combinational logic circuit, a plurality of flip-flops including a first flip-flop configured to receive a first scan input signal and a first data signal, and a first core block including a multiplexer. The multiplexer may be configured to select, based on a test control signal, one of a primary input signal received through a primary input terminal and an output signal of the first flip-flop and provide the selected signal to the first combinational logic circuit. The first flip-flop may be further configured to selectively receive, based on a scan control signal, one of the first scan input signal and the first data signal.
    Type: Application
    Filed: May 22, 2024
    Publication date: January 23, 2025
    Inventors: Seaeun Park, Saeeun Kim, Thai Hoang Nguyen, Joon-sung Yang
  • Publication number: 20240310437
    Abstract: An integrated circuit includes: (i) a first block containing a first wrapper and a first area of circuit elements isolated by the first wrapper, (ii) a core logic circuit containing a target block, which includes a second wrapper and a second area of circuit elements isolated by the second wrapper, and a third wrapper and a third area of circuit elements isolated by the third wrapper, and (iii) a second block containing a fourth wrapper and a fourth area isolated by the fourth wrapper. The second wrapper is connected in series with the first wrapper, and is configured to support performance of a test operation on the second area. The third wrapper is connected in series with the fourth wrapper, and is configured to support performance of a test operation on the third area.
    Type: Application
    Filed: March 13, 2024
    Publication date: September 19, 2024
    Inventors: Seaeun Park, Saeeun Kim