Patents by Inventor Saeko SATO

Saeko SATO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10941242
    Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: March 9, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Saeko Sato, Yuiga Asai, Tomotaka Wada, Takuma Hanaoka
  • Patent number: 10920018
    Abstract: A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes a structural unit (A-1) derived from a compound represented by the following formula (a-1), and the structural unit B includes a structural unit (B-1) derived from a compound represented by the following formula (b-1): wherein m and n in the formula (b-1) each independently are an integer of 0 or 1.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: February 16, 2021
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yohei Abiko, Saeko Sato, Aoi Daito, Shinji Sekiguchi
  • Patent number: 10752729
    Abstract: A coating film formed by curing of an epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent and a solvent, wherein the coating film contains the solvent in a ratio of 1% by mass or more and 20% by mass or less, and the epoxy resin curing agent is a reaction product of the following (A) and (B). (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine. (B) At least one selected from the group consisting of an unsaturated carboxylic acid represented by the following formula (1) and a derivative thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms, or an aryl group.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: August 25, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Kazuki Kouno, Saeko Sato, Tomotaka Wada, Yuiga Asai
  • Publication number: 20200055987
    Abstract: A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes a structural unit (A-1) derived from a compound represented by the following formula (a-1), and the structural unit B includes a structural unit (B-1) derived from a compound represented by the following formula (b-1): wherein m and n in the formula (b-1) each independently are an integer of 0 or 1.
    Type: Application
    Filed: April 21, 2017
    Publication date: February 20, 2020
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yohei ABIKO, Saeko SATO, Aoi DAITO, Shinji SEKIGUCHI
  • Publication number: 20190112416
    Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Application
    Filed: April 4, 2017
    Publication date: April 18, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Saeko SATO, Yuiga ASAI, Tomotaka WADA, Takuma HANAOKA
  • Publication number: 20180118877
    Abstract: A coating film formed by curing of an epoxy resin composition containing at least an epoxy resin, an epoxy resin curing agent and a solvent, wherein the coating film contains the solvent in a ratio of 1% by mass or more and 20% by mass or less, and the epoxy resin curing agent is a reaction product of the following (A) and (B). (A) At least one selected from the group consisting of metaxylylenediamine and paraxylylenediamine. (B) At least one selected from the group consisting of an unsaturated carboxylic acid represented by the following formula (1) and a derivative thereof: wherein R1 and R2 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aralkyl group having 1 to 8 carbon atoms, or an aryl group.
    Type: Application
    Filed: June 1, 2016
    Publication date: May 3, 2018
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Kazuki KOUNO, Saeko SATO, Tomotaka WADA, Yuiga ASAI