Abstract: A method retargets an image to a different size. An input image is segmented into regions. Selected regions are cut from the input image to construct a background image. The background image is scaled to a predetermined size, and the selected regions are pasted back into the scaled background image to produce an output image.

Abstract: A method retargets an image to a different size. An input image is segmented into regions. Selected regions are cut from the input image to construct a background image. The background image is scaled to a predetermined size, and the selected regions are pasted back into the scaled background image to produce an output image.

Abstract: A lead frame comprising a plurality of leads and a die pad disposed at a position surrounded by top ends on one side of the leads, wherein at least the outermost layer on the obverse of the die pad comprises a nickel plated layer, as well as a semiconductor device comprising the lead frame and a semiconductor element mounted by way of a bonding agent on the nickel plated layer at the obverse of the die pad.

Abstract: A laminate-type semiconductor apparatus utilizing a flexible substrate being mounted with a plurality of semiconductor devices, in which the laminate-type semiconductor apparatus is free from incurring heat-radiation problem and has a fully leveled connection parts with sufficiently durable strength whereby distinctively compatible with high-density mounting thereof. More particularly, the present invention provides a laminate-type semiconductor apparatus which comprises a foldable flexible substrate mounted with a plurality of laminated semiconductor devices thereon, in which the foldable flexible substrate is folded so that plurality of semiconductor-device mounting areas of the substrate are mutually superposed whereby forming a laminate structure of semiconductor-device mounting areas thereon. An externally connected terminal disposing area disposed with a plurality of externally connected terminals is formed on one surface thereof.

Abstract: A laminate-type semiconductor apparatus utilizing a flexible substrate being mounted with a plurality of semiconductor devices, in which the laminate-type semiconductor apparatus is free from incurring heat-radiation problem and has a fully leveled connection parts with sufficiently durable strength whereby distinctively compatible with high-density mounting thereof. More particularly, the present invention provides a laminate-type semiconductor apparatus which comprises a foldable flexible substrate mounted with a plurality of laminated semiconductor devices thereon, in which the foldable flexible substrate is folded so that plurality of semiconductor-device mounting areas of the substrate are mutually superposed whereby forming a laminate structure of semiconductor-device mounting areas thereon. An externally connected terminal disposing area disposed with a plurality of externally connected terminals is formed on one surface thereof.