Patents by Inventor Saet-Byeol LEE

Saet-Byeol LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 10886253
    Abstract: A semiconductor package is provided. The semiconductor package includes: a mounting substrate including at least one bonding pad; a first semiconductor chip disposed on the mounting substrate, and including a first protrusion on one side of the first semiconductor chip; a first spacer ball electrically connected to the first semiconductor chip; a first bump ball electrically connected to the first spacer ball; and a first wire which electrically connects the first bump ball and the bonding pad without contacting the first protrusion, wherein the first wire includes a first portion extending in a direction away from the bonding pad, and a second portion extending in a direction approaching the bonding pad.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: January 5, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Saet Byeol Lee, You Kyung Son, Seung Lo Lee, Won Gil Han, Ho Soo Han
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200066678
    Abstract: A semiconductor package is provided. The semiconductor package includes: a mounting substrate including at least one bonding pad; a first semiconductor chip disposed on the mounting substrate, and including a first protrusion on one side of the first semiconductor chip; a first spacer ball electrically connected to the first semiconductor chip; a first bump ball electrically connected to the first spacer ball; and a first wire which electrically connects the first bump ball and the bonding pad without contacting the first protrusion, wherein the first wire includes a first portion extending in a direction away from the bonding pad, and a second portion extending in a direction approaching the bonding pad.
    Type: Application
    Filed: April 10, 2019
    Publication date: February 27, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Saet Byeol Lee, You Kyung Son, Seung Lo Lee, Won Gil Han, Ho Soo Han
  • Electronic device, user interface method in the electronic device, and cover of the electronic device
    Patent number: 9952629
    Abstract: Disclosed are an electronic device, a User Interface (UI) method in the electronic device, and a cover of the electronic device. The electronic device includes a touch screen, and a controller configured to determine whether a cover covers the touch screen, to define a first area and a second area on the touch screen respectively in correspondence with a window area and a keyboard area of the cover, when the cover covers the touch screen, and to control display of a keypad related to contents displayed in the first area in the second area.
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: April 24, 2018
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Soo-Hak Chae, Jae-Ho Kim, Saet-Byeol Lee, Jae-Yup Hwang
  • ELECTRONIC DEVICE, USER INTERFACE METHOD IN THE ELECTRONIC DEVICE, AND COVER OF THE ELECTRONIC DEVICE
    Publication number: 20150346779
    Abstract: Disclosed are an electronic device, a User Interface (UI) method in the electronic device, and a cover of the electronic device. The electronic device includes a touch screen, and a controller configured to determine whether a cover covers the touch screen, to define a first area and a second area on the touch screen respectively in correspondence with a window area and a keyboard area of the cover, when the cover covers the touch screen, and to control display of a keypad related to contents displayed in the first area in the second area.
    Type: Application
    Filed: June 1, 2015
    Publication date: December 3, 2015
    Inventors: Soo-Hak CHAE, Jae-Ho KIM, Saet-Byeol LEE, Jee-Yup HWANG