Patents by Inventor Sagar Trivedi
Sagar Trivedi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250078915Abstract: A multi-bank memory includes: a pair of far banks coupled to a first word line and a first pair of local bitlines, respectively; a pair of near banks coupled to a second word line and a second pair of local bitlines, respectively; a far global bit line coupled to the first pair of local bitlines; a first NAND gate having a first input coupled to the second pair of local bitlines and a second input coupled to the far global bit line; a near global bit line coupled to the output of the first NAND gate; and a global input/output (I/O) circuit, coupled to the near global bit line, for outputting data.Type: ApplicationFiled: August 26, 2024Publication date: March 6, 2025Applicant: MediaTek Singapore Pte. Ltd.Inventors: Jaswinder Singh Sidhu, Manish Trivedi, Sumanth Katte Gururajarao, Sagar Y Abachi
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Publication number: 20230384690Abstract: A method of manufacturing a photo mask includes determining an enhancement region, in a simulation zone, of a layout pattern of a photo mask. The method includes determining a stitching mobility zone inside the simulation zone, determining an optimization mobility zone inside the stitching mobility zone, and performing an inverse lithographic transformation (ILT) operation of the layout pattern in the simulation zone to generate an ILT adjusted layout pattern in the simulation zone. The method includes combining a weighted sum of the ILT adjusted layout pattern and the layout pattern in the simulation zone to generate an enhanced layout pattern of the photo mask in the simulation zone using a first weighting function inside enhancement region, a second weighting function between boundaries of the enhancement region and the optimization mobility zone, and a third weighting function between boundaries of the optimization mobility zone and the stitching mobility zone.Type: ApplicationFiled: August 7, 2023Publication date: November 30, 2023Inventors: Sagar TRIVEDI, Daniel Beylkin
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Patent number: 11747786Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: GrantFiled: May 23, 2022Date of Patent: September 5, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu
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Publication number: 20220299884Abstract: A method of manufacturing a photo mask includes determining an enhancement region, in a simulation zone, of a layout pattern of a photo mask. The method includes determining a stitching mobility zone inside the simulation zone, determining an optimization mobility zone inside the stitching mobility zone, and performing an inverse lithographic transformation (ILT) operation of the layout pattern in the simulation zone to generate an ILT adjusted layout pattern in the simulation zone. The method includes combining a weighted sum of the ILT adjusted layout pattern and the layout pattern in the simulation zone to generate an enhanced layout pattern of the photo mask in the simulation zone using a first weighting function inside enhancement region, a second weighting function between boundaries of the enhancement region and the optimization mobility zone, and a third weighting function between boundaries of the optimization mobility zone and the stitching mobility zone.Type: ApplicationFiled: March 19, 2021Publication date: September 22, 2022Inventors: Sagar TRIVEDI, Daniel BEYLKIN
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Publication number: 20220291659Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: ApplicationFiled: May 23, 2022Publication date: September 15, 2022Inventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu
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Patent number: 11340584Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: GrantFiled: February 8, 2021Date of Patent: May 24, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu
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Publication number: 20210181713Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: ApplicationFiled: February 8, 2021Publication date: June 17, 2021Inventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu
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Patent number: 10915090Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: GrantFiled: June 1, 2020Date of Patent: February 9, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu
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Publication number: 20200293023Abstract: Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.Type: ApplicationFiled: June 1, 2020Publication date: September 17, 2020Inventors: Danping Peng, Junjiang Lei, Daniel Beylkin, Kenneth Lik Kin Ho, Sagar Trivedi, Fangbo Xu