Patents by Inventor Sage DOSHAY

Sage DOSHAY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10707118
    Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: July 7, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ludovic Godet, Wayne McMillan, Rutger Meyer Timmerman Thijssen, Naamah Argaman, Tapashree Roy, Sage Doshay
  • Publication number: 20190318957
    Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.
    Type: Application
    Filed: February 22, 2019
    Publication date: October 17, 2019
    Inventors: Ludovic GODET, Wayne MCMILLAN, Rutger MEYER TIMMERMAN THIJSSEN, Naamah ARGAMAN, Tapashree ROY, Sage DOSHAY