Patents by Inventor Sagi Chen

Sagi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240337258
    Abstract: An ultrasonic pump includes a first layer with at a membrane, a spoke and an anchor, wherein the membrane is in contact with the spoke and the spoke is in contact with at the anchor; a second layer with at least one second membrane and at least one second anchor wherein the second membrane is in contact with a second anchor and the second membrane includes at least one aperture; a third layer with at least one third membrane, at least one third spoke and at least one third anchor, wherein third membrane is in contact with at least one third spoke and said third spoke is in contact with at least one third anchor. The first, second and third membrane are vertically stacked and the first layer at least one membrane and the third layer at least one membrane are configured to be actuated to generate fluid flow.
    Type: Application
    Filed: April 5, 2024
    Publication date: October 10, 2024
    Inventors: Mordehai Margalit, Sagi Chen, Mikkel Mosbæk Qvist Harteg
  • Publication number: 20240340576
    Abstract: An ultrasonic pump includes a mechanical layer with at least one membrane; and an acoustic channel. A portion of the at least one membrane comprises at least a part of the acoustic channel so that a movement of the membrane changes the dimension of the acoustic channel. The membrane is configured to oscillate at ultrasonic frequencies and generate at least one audio signal.
    Type: Application
    Filed: April 5, 2024
    Publication date: October 10, 2024
    Inventors: Mordehai Margalit, Sagi Chen, Mikkel Mosbæk Qvist Harteg
  • Publication number: 20240163599
    Abstract: Earphones are configured to include an ear-tip to accommodate insertion into an ear canal and provide a leak free or low leakage acoustic connection between a speaker embedded in the earphone body and the ear. The earphone in this disclosure is further configured to attach to an earphone support member which provides either mechanical or user functionality to the earphone.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Inventors: Jakob Kjær Nielsen, Luca Brazzale, Giacomo Mantefalcone, Sagi Chen, Ari Mizrachi, Mordehai Margalit