Patents by Inventor Sagi Varhgese Mathai

Sagi Varhgese Mathai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite wafer including a molded wafer and a second wafer
    Patent number: 9354388
    Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: May 31, 2016
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Georgios Panotopoulos, Paul Kessler Rosenberg, Sagi Varhgese Mathai, Wayne Victor Sorin, Susant K. Patra
  • COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER
    Publication number: 20140334774
    Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.
    Type: Application
    Filed: July 30, 2014
    Publication date: November 13, 2014
    Inventors: Michael Renne Ty Tan, Georgios Panotopoulos, Paul Kessler Rosenberg, Sagi Varhgese Mathai, Wayne Victor Sorin, Susant