Patents by Inventor Sai Aditya CHUNDI

Sai Aditya CHUNDI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12101143
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a receiving device may receive a wireless signal represented as a receive matrix. The wireless signal carries one or more information symbols modified through a wireless channel that is represented as a channel matrix. The receiving device may perform QR decomposition on the channel matrix to generate an upper triangular channel matrix. The receiving device may determine a selected demapping technique using the upper triangular channel matrix. The receiving device may perform the selected demapping technique on the receive matrix and the channel matrix. Numerous other aspects are described.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: September 24, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Gowrisankar Somichetty, Ganesh Nagamani, Hong Zhang, Lokesh Sundaramurthy Satrasala, Pratik Vinod Agrawal, Sai Aditya Chundi, Leiter Kang, Ramakrishna Vadlamani
  • Publication number: 20240283497
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a receiving device may receive a wireless signal represented as a receive matrix. The wireless signal carries one or more information symbols modified through a wireless channel that is represented as a channel matrix. The receiving device may perform QR decomposition on the channel matrix to generate an upper triangular channel matrix. The receiving device may determine a selected demapping technique using the upper triangular channel matrix. The receiving device may perform the selected demapping technique on the receive matrix and the channel matrix. Numerous other aspects are described.
    Type: Application
    Filed: February 16, 2023
    Publication date: August 22, 2024
    Inventors: Gowrisankar SOMICHETTY, Ganesh NAGAMANI, Hong ZHANG, Lokesh Sundaramurthy SATRASALA, Pratik Vinod AGRAWAL, Sai Aditya CHUNDI, Leiter KANG, Ramakrishna VADLAMANI