Patents by Inventor Sai Choo TAN

Sai Choo TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR ATTACHING INTEGRATED CIRCUIT COMPONENT TO A SUBSTRATE
    Publication number: 20080108181
    Abstract: An integrated circuit component is attached to a substrate by dispensing a controlled amount of photo-activatable anisotropic conductive adhesive (ACA) at a desired location on the substrate, exposing the dispensed ACA to an electromagnetic radiation source to initiate a chemical reaction in the ACA, aligning the component with the substrate such that a bond pad on the component faces the dispensed ACA, bonding the component to the substrate under a low pressure loading, and heating the bonded component and substrate.
    Type: Application
    Filed: November 6, 2006
    Publication date: May 8, 2008
    Applicant: CITY UNIVERSITY OF HONG KONG
    Inventors: Yan Cheong CHAN, Sai Choo TAN