Abstract: Disclosed is a method of coating a structured surface comprising the steps of providing nanoparticles of a first coating material, and depositing the nanoparticles onto a structured surface using electrophoretic deposition. The structured surface may comprise one or more carbon nanotubes which maybe an array. The coating material may be a dielectric material such as barium titanate which may have a particle size of approximately 20 nm diameter. Following the deposition step a second coating may be provided. The second coating may be hafnium oxide. Also disclosed is a capacitor comprising a first electrode of a structured material, a second electrode of conducting material, and a dielectric layer formed between the first and second electrode.

Abstract: Disclosed is a capacitor (200) comprising a first structured surface having a dielectric coating (230), a second structured surface having a dielectric coating (230), a separator (240) provided between the first structured surface and the second structured surface, and an electrolyte provided between the first structured surface and the second structured surface. The structured surface may be formed from carbon which may be a random array of carbon nanotubes having a spacing to length ratio of the carbon nanotubes is not greater than 1:30. The dielectric coating may be selected from but not limited to hafnium oxide, barium titanate (BTO), BST, PZT, CCTO or titanium dioxide or a combination of two or more such materials.

Abstract: A method of depositing a material on a substrate using an atomic layer deposition process, wherein the deposition process comprises a first deposition step, a second deposition step subsequent to the first deposition step, and a delay of at least one minute between the first deposition step and the second deposition step. Each deposition step comprises a plurality of deposition cycles. The delay is introduced to the deposition process by prolonging a period of time for which a purge gas is supplied to a process chamber housing the substrate at the end of a selected one of the deposition cycles.