Abstract: The invention relates to an unmanned aerial vehicle (UAV). The UAV comprises a body housing control and wireless communication circuitry for the UAV and a rechargeable power source. The UAV has a plurality of propellers surrounding the body and supported so as to be spaced outwardly from and preferably above the body. A gimbal is mounted under a forward portion of the body for supporting a camera. The gimbal may be arranged under the forward portion of the body such that an angle of a forward vertical field of view of the camera is less than an angle of a forward vertical clearance field of view defined with respect to a forward tip of at least one of the propellers. The gimbal may be arranged under the forward portion of the body such that a lens of a camera supported thereon is substantially in line with a front edge of the UAV body.

Abstract: The invention relates to a ground station for a UAV comprising a housing for accommodating a system on chip (SOC) circuit including a control processor for executing software to wirelessly control functions of the UAV, a first screen, and a second screen, wherein one or both screens are controlled directly by the SOC control processor. The housing may comprise a clam shell housing comprising a first housing member for accommodating the control processor and a second housing member movable relative to the first housing member between a first closed position overlaying said first housing member and a second open position. The arrangement is such that the first housing member has mounted thereon the first screen and the second housing member has mounted thereon the second screen such that both screens are viewable by a user when the second housing member is in its open position.

Abstract: The invention relates to an unmanned aerial vehicle (UAV). The UAV comprises a body housing control and wireless communication circuitry for the UAV and a rechargeable power source. The UAV has a plurality of propellers surrounding the body and supported so as to be spaced outwardly from and preferably above the body. A gimbal is mounted under a forward portion of the body for supporting a camera. The gimbal may be arranged under the forward portion of the body such that an angle of a forward vertical field of view of the camera is less than an angle of a forward vertical clearance field of view defined with respect to a forward tip of at least one of the propellers. The gimbal may be arranged under the forward portion of the body such that a lens of a camera supported thereon is substantially in line with a front edge of the UAV body.

Abstract: The invention relates to a ground station for a UAV comprising a housing for accommodating a system on chip (SOC) circuit including a control processor for executing software to wirelessly control functions of the UAV, a first screen, and a second screen, wherein one or both screens are controlled directly by the SOC control processor. The housing may comprise a clam shell housing comprising a first housing member for accommodating the control processor and a second housing member movable relative to the first housing member between a first closed position overlaying said first housing member and a second open position. The arrangement is such that the first housing member has mounted thereon the first screen and the second housing member has mounted thereon the second screen such that both screens are viewable by a user when the second housing member is in its open position.

Abstract: A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.

Abstract: Disclosed herein is a novel rinsing agent, which may be suitable for use in surgical, and, in particular, ophthalmological procedures. The rinsing agent may by employed to remove emulsified oil droplets from the eye cavity. Also disclosed is a method for effectively removing emulsified silicone oil droplets remaining in the eye cavity after ophthalmological procedures using the disclosed rinsing agent in order to prevent the development of long-term complications associated with the emulsified oil droplets.

Abstract: The present disclosure generally relates to an input method including the steps of: receiving a key event sequence inputted by a keyboard; comparing the key event sequence with prestored data, determining whether the key event sequence is a sequence predefined by the prestored data; if the key event sequence is determined to be the sequence predefined by the prestored data, finding an input command corresponding with the key event sequence according to a mapping relationship and sending the input command to a command processing system. By using the input method, a keyboard using feature value of the key event sequence to map to a corresponding input command, which makes the condition of the keyboard determines whether an input command is triggered no longer depending on the physical location of one key strictly.

Abstract: A calibration wafer may bear one or more different mark types to facilitate inspection of a lithography process. A first mark type may be located on the outer peripheral portion of the wafer to indicate the desired boundary of an edge bead removal (EBR) region. A second mark type may be located on an outer peripheral portion of the wafer to indicate the desired boundary of a wafer edge expose region (WEE). A third mark type may indicate the border of a portion of the wafer expected to bear a wafer identification mark. A fourth mark type may be located at the center of the wafer to allow for precise and uniform application of liquid photoresist material to the calibration wafer. The calibration wafer may be employed in methods of rapidly and easily assessing the accuracy of various phases of photolithography processes.

Abstract: The present invention relates to a composition for use in the treatment of a detached retina, comprising a dispersion of nanoparticles in a liquid, wherein the nanoparticles have a specific gravity which is higher than that of the liquid and the individual refractive indices of the nanoparticles and the liquid are substantially similar to one another. The present invention also relates to a composition for use in the treatment of a detached retina, comprising a dispersion of silica nanoparticles in a liquid, a method and kit of parts for producing the compositions and a method of treating a detached retina.

Abstract: A method and apparatus to eliminate contaminants in a lithography process for fabrication of integrated circuit devices. The method includes depositing a photoresist material on surface of a semiconductor substrate. A purge gas flow is provided proximate to an optical element to prevent a vapor from the exposed photoresist material from coming into contact with the optical element. In one embodiment, the purge gas flows into a perforated and open ended enclosure in which the optical element is provided in the form of a lens. One open end of the enclosure is coupled to the lens and the other open end is positioned above the surface of the semiconductor substrate. Perforation of the enclosure facilitates movement of purge gas thereto, eliminating contact with the vapor from the developed resist and unwanted deposition of a solid contamination on the lens.

Abstract: A method and apparatus to eliminate contaminants in a lithography process for fabrication of integrated circuit devices. The method includes depositing a photoresist material on surface of a semiconductor substrate. A purge gas flow is provided proximate to an optical element to prevent a vapor from the exposed photoresist material from coming into contact with the optical element. In one embodiment, the purge gas flows into a perforated and open ended enclosure in which the optical element is provided in the form of a lens. One open end of the enclosure is coupled to the lens and the other open end is positioned above the surface of the semiconductor substrate. Perforation of the enclosure facilitates movement of purge gas thereto, eliminating contact with the vapor from the developed resist and unwanted deposition of a solid contamination on the lens.

Abstract: An optical encoder includes an optical encoder pattern of alternating light elements and dark elements, and an optical unit, including an optical emitter providing light to the encoder pattern, and an optical sensor including a photo-detector receiving the light from the optical encoder pattern and in response thereto outputting a sinusoidal signal indicating relative movement between the optical sensor and the encoder pattern. In one embodiment, the photo-detector has a diamond shape, a modified-diamond shape, or an hourglass shape. In another embodiment, at least one of the light elements and the dark elements of the optical encoder pattern has a diamond shape, a modified-diamond shape, or an hourglass shape.