Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Systems, methods, and other embodiments associated with a data view for clinical data are described. In one embodiment, a method includes receiving a request from a user to view summarized case report form (CRF) data, where the CRF data corresponds to a plurality case report forms (CRFs) stored in one or more normalized transactional tables. A view query is constructed based, at least in part, on the request and executed on one or more denormalized summary tables to construct a view. The denormalized summary tables store selected CRF data from the normalized transactional tables and are updated concurrently with each update to the transactional tables. The method includes rendering the view for display.

Abstract: Systems, methods, and other embodiments associated with a data view for clinical data are described. In one embodiment, a method includes receiving a request from a user to view summarized case report form (CRF) data, where the CRF data corresponds to a plurality case report forms (CRFs) stored in one or more normalized transactional tables. A view query is constructed based, at least in part, on the request and executed on one or more denormalized summary tables to construct a view. The denormalized summary tables store selected CRF data from the normalized transactional tables and are updated concurrently with each update to the transactional tables. The method includes rendering the view for display.

Abstract: An improved metal etching process including preparation of a metal substrate, developing a photoresist on the substrate, coating the exposed substrate with electroless phosphorous nickel alloy, removing the developed photoresist and etching the then exposed substrate. The preparation for depositing the electroless nickel includes washing the surface of the substrate with a very dilute acidic ferric chloride solution, immersing the substrate in a hydrochloric acid solution, and applying a thin metal layer by electrolytic plating, seriatim.