Patents by Inventor Sai Man Li

Sai Man Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package and manufacturing method thereof
    Patent number: 6573123
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: June 3, 2003
    Inventors: Sai Man Li, Chun Hung Lin, Shin Hua Chao, Su Tao
  • Semiconductor chip package and manufacturing method thereof
    Publication number: 20020056903
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sai Man Li, Chun Hung Li, Shin Hua Chao, Su Tao
  • Semiconductor chip package and manufacturing method thereof
    Patent number: 6348729
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: February 19, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sai Man Li, Chun Hung Lin, Shin Hua Chao, Su Tao