Abstract: The printed circuit board for the memory card includes an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Abstract: Provided is a printed circuit board, including: a circuit pattern or a base pattern formed on an insulating layer; and a plurality of metal layers formed on the circuit pattern or the base pattern, wherein the metal layers includes: a silver metal layer formed of a metal material including silver; a first palladium metal layer formed at a lower part of the silver metal layer; and a second palladium metal layer formed at an upper part of the silver metal layer.

Abstract: Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.

Abstract: The present invention relates to a multi-row leadframe for semiconductor packaging, characterized by: forming a plating pattern on a leadframe material (first step); forming a protective pattern on the plating pattern (second step); and forming a nano pattern by using the protective pattern as a mask (third step), whereby a protective pattern is formed on an upper surface of a plating pattern to increase reliability of a product by preventing damage to a plating layer caused by etching solution during pattern formation of leadframe and to thereby solve the problem of using the plating layer as an etching mask.