Patents by Inventor Sai Srinivas Desabathina
Sai Srinivas Desabathina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147631Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.Type: ApplicationFiled: February 25, 2022Publication date: May 2, 2024Applicant: Liquid Wire, LLCInventors: Jorge E. Carbo, JR., Sai Srinivas Desabathina, Michael Adventure Hopkins, Charles J. Kinzel, Mark S. Kruskopf, Jesse Michael Martinez, Katherine M. Nelson, Taylor V. Neumann, Trevor Antonio Rivera, Mark William Ronay, Michael Jasper Wallans, Austin Michael Clarke
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Publication number: 20240047334Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 12, 2023Publication date: February 8, 2024Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Patent number: 11882653Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 17, 2022Date of Patent: January 23, 2024Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Patent number: 11688677Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 18, 2021Date of Patent: June 27, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Patent number: 11682615Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: GrantFiled: May 28, 2020Date of Patent: June 20, 2023Assignee: Liquid Wire Inc.Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Publication number: 20220377885Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 17, 2022Publication date: November 24, 2022Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Publication number: 20210272891Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 18, 2021Publication date: September 2, 2021Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
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Publication number: 20200381349Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.Type: ApplicationFiled: May 28, 2020Publication date: December 3, 2020Applicant: Liquid Wire Inc.Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina