Patents by Inventor Sai Srinivas Desabathina

Sai Srinivas Desabathina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240147631
    Abstract: Devices, systems, and methods for making and using highly sustainable circuit assemblies are disclosed herein. In various aspects, the highly sustainable circuit assembly includes a substrate layer; and a pattern of contact points supported by the substrate layer. The pattern of contact points can be configured to correspond to at least one terminal of an electrical component. The pattern of contact points can include a deformable conductive material. The deformable conductive material can be a non-hazardous, readily reclaimable, readily recyclable material.
    Type: Application
    Filed: February 25, 2022
    Publication date: May 2, 2024
    Applicant: Liquid Wire, LLC
    Inventors: Jorge E. Carbo, JR., Sai Srinivas Desabathina, Michael Adventure Hopkins, Charles J. Kinzel, Mark S. Kruskopf, Jesse Michael Martinez, Katherine M. Nelson, Taylor V. Neumann, Trevor Antonio Rivera, Mark William Ronay, Michael Jasper Wallans, Austin Michael Clarke
  • Publication number: 20240047334
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 12, 2023
    Publication date: February 8, 2024
    Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Patent number: 11882653
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: January 23, 2024
    Assignee: Liquid Wire Inc.
    Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Patent number: 11688677
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: June 27, 2023
    Assignee: Liquid Wire Inc.
    Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Patent number: 11682615
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: June 20, 2023
    Assignee: Liquid Wire Inc.
    Inventors: Mark William Ronay, Jorge E. Carbo, Jr., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Publication number: 20220377885
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 24, 2022
    Inventors: Mark William Ronay, Jorge E. Carbo, JR., Trevor Antonio Rivera, Charles J. Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Publication number: 20210272891
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina
  • Publication number: 20200381349
    Abstract: A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 3, 2020
    Applicant: Liquid Wire Inc.
    Inventors: Mark Ronay, Jorge E. Carbo, Trevor Spiegel Antonio Rivera, Charles Kinzel, Michael Adventure Hopkins, Sai Srinivas Desabathina