Patents by Inventor Sai Veruva

Sai Veruva has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240066178
    Abstract: The invention relates to biodegradable bilayer sealants for tissue closure. The sealants of the invention are composed of two layers with different compliances. The layer in immediate contact with the tissue has high compliance. The second layer located immediately above the first sealant layer has low compliance, i.e. the sealant is much stiffer. The burst pressure of the bilayer sealants is enhanced relative to either a single layer elastic sealant or a single layer stiff sealant. The improved sealant compositions herein provide a water-tight seal, can access hard to reach tears, be applied in a dry or wet environment, are low-swelling, and can repair a range of incision or tear sizes. The bilayer sealants are particularly useful for sutureless dural closure or as adjuncts to sutured dural closure. Also provided herein are methods of preparing and using the biodegradable sealant compositions.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Applicant: Ethicon, Inc.
    Inventors: Salim A. Ghodbane, Sai Veruva, Mark Neubauer
  • Publication number: 20230355831
    Abstract: Provided herein are compositions, systems and surgical methods for treating expandable soft tissue utilizing a reactive liquid hydrogel sealant mixture including a cross-linkable electrophilic compound, a nucleophilic compound, and an amphiphilic poly(alkyl)ene glycol block polymer in an amount of 20% (w/v) or less of the sealant composition. The composition can optionally include a viscosifier, in an amount of 0.1% to 1.0% (w/v) of the sealant composition.
    Type: Application
    Filed: May 6, 2022
    Publication date: November 9, 2023
    Inventors: Sai Veruva, Salim Ghodbane, Thomas Weindl
  • Publication number: 20220023488
    Abstract: The present invention is directed to medical devices having a first porous substrate layer with at least a surface coating thereon of a first co-reactive component and a second substrate layer with at least a surface coating layer of a second co-reactive component that reacts with the first co-reactive component, and a removable barrier layer positioned between the first substrate layer and second substrate layer and in contact with said first substrate layer and said second substrate layer.
    Type: Application
    Filed: July 21, 2020
    Publication date: January 27, 2022
    Inventors: Nir Nativ, Gerard Llanos, Thomas Weindl, Sai Veruva
  • Publication number: 20210379237
    Abstract: The present invention is directed to an absorbable hemostatic patch that utilizes a biocompatible fibrous, fabric substrate that is melt-blown and napped or loosened at the surface, with the substrate having a low-profile, high flexibility, strength and porosity that is suitable for coating cross-linkable active molecules and ultimately effective for use as a hemostat in situations of problematic bleeding.
    Type: Application
    Filed: June 8, 2020
    Publication date: December 9, 2021
    Inventors: Sai Veruva, Jianguo Zhou, Joseph Vliet, Gerard Llanos
  • Publication number: 20210252185
    Abstract: The present invention is directed to an absorbable hemostatic nonwoven patch that utilizes a biocompatible substrate comprised of melt-blown microfibers as webbed sheets that are layered and bonded/entangled in descending density and ascending porosity; with the substrate having a high flexibility, strength and porosity that is suitable for coating cross-linkable active molecules and ability for laparoscopic use or trocar deployment, ultimately for functional use as a highly effective hemostat in addressing problematic bleeding during both open and minimally invasive surgical procedures.
    Type: Application
    Filed: February 18, 2020
    Publication date: August 19, 2021
    Inventors: Sai Veruva, Jianguo Zhou, Joseph Vliet, Gerard Llanos, Kenneth Keilman