Patents by Inventor Sai Yuen GO

Sai Yuen GO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding apparatus comprising an inert gas environment
    Patent number: 10475763
    Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: November 12, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Siu Wing Lau, Kin Yik Hung, Yuk Cheung Au, Wing Chiu Lai, Leo Man Lee, Sai Yuen Go
  • DIE BONDING APPARATUS COMPRISING AN INERT GAS ENVIRONMENT
    Publication number: 20160351527
    Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.
    Type: Application
    Filed: May 20, 2016
    Publication date: December 1, 2016
    Inventors: Siu Wing LAU, Kin Yik HUNG, Yuk Cheung AU, Wing Chiu LAI, Leo Man LEE, Sai Yuen GO