Patents by Inventor SAIHSI JEN

SAIHSI JEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate having die pad with outer raised portion and interior recessed portion
    Patent number: 8546184
    Abstract: A method of forming an electronic assembly includes dispensing a die attach material on a substrate into a recessed portion that includes an inner recessed portion of including a die pad. The die attach material is not dispensed on an outer raised flat portion of the die pad. A semiconductor die is attached directly on the outer raised flat portion and affixed to the die pad with said die attach material in said interior recessed portion but not on said outer raised flat portion.
    Type: Grant
    Filed: January 4, 2013
    Date of Patent: October 1, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Chih-Chien Ho, Saihsi Jen, Eric Hsieh
  • Package substrate having die pad with outer raised portion and interior recessed portion
    Patent number: 8455989
    Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: June 4, 2013
    Assignee: Texas Instruments Incorporated
    Inventors: Chih-Chien Ho, Saihsi Jen, Eric Hsieh
  • PACKAGE SUBSTRATE HAVING DIE PAD WITH OUTER RAISED PORTION AND INTERIOR RECESSED PORTION
    Publication number: 20130001760
    Abstract: An electronic assembly includes a substrate including a die pad, where the die pad includes and an outer raised flat portion and a recessed portion that includes an inner recessed portion. A semiconductor die is directly on the outer raised flat portion and affixed to the die pad by a die attach material that is in the inner recessed portion. The die attach material is not on a top surface of the outer raised flat portion.
    Type: Application
    Filed: July 1, 2011
    Publication date: January 3, 2013
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: CHIH-CHIEN HO, SAIHSI JEN, ERIC HSIEH