Patents by Inventor Saika HONMA

Saika HONMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite and production method thereof
    Patent number: 11274176
    Abstract: A composite including a plurality of block copolymer chains dispersed in a base polymer, the block copolymer chains including a polymer block (A) and a polymer block (B) having lower affinity for the base polymer than that of the polymer block (A), wherein each of the block copolymer chains has the polymer block (A) at two or more locations of the block copolymer chain, and in at least some of the block copolymer chains, the polymer blocks (A) are at least partially located in the base polymer and the polymer blocks (B) are at least partially exposed from the base polymer.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: March 15, 2022
    Assignees: NATIONAL INSTITUTE OF TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY, KYOTO UNIVERSITY, NISSHINBO HOLDINGS INC.
    Inventors: Takaya Sato, Hiroyuki Arafune, Takashi Morinaga, Saika Honma, Toshio Kamijo, Ken Nakano, Yoshinobu Tsujii
  • COMPOSITE AND PRODUCTION METHOD THEREOF
    Publication number: 20200002455
    Abstract: A composite including a plurality of block copolymer chains dispersed in a base polymer, the block copolymer chains including a polymer block (A) and a polymer block (B) having lower affinity for the base polymer than that of the polymer block (A), wherein each of the block copolymer chains has the polymer block (A) at two or more locations of the block copolymer chain, and in at least some of the block copolymer chains, the polymer blocks (A) are at least partially located in the base polymer and the polymer blocks (B) are at least partially exposed from the base polymer.
    Type: Application
    Filed: March 2, 2018
    Publication date: January 2, 2020
    Applicants: NATIONAL INSTITUTE OF TECHNOLOGY, NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY, KYOTO UNIVERSITY, NISSHINBO HOLDINGS INC.
    Inventors: Takaya SATO, Hiroyuki ARAFUNE, Takashi MORINAGA, Saika HONMA, Toshio KAMIJO, Ken NAKANO, Yoshinobu TSUJII