Abstract: A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes. The package has a back face opposed to the front face and a bottom face that is located between the back face and the front face. The bottom face is adjacent to the front face. The outer lead electrodes protrude from the bottom face of the package. An end of each of the outer lead electrodes branches in at least two distal end parts on the bottom face. One of the distal end parts of each of the outer lead electrodes extends toward one of side faces of the package and is bent along the side face, and other one of the distal end parts of each of the outer lead electrodes extends toward the back face of the package.

Abstract: A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

Abstract: A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

Abstract: A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

Abstract: The semiconductor device 1 comprises a housing 12 which has a recess 24 in the front surface 1; a pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12, and are bent along the bottom surface 16 of the housing 12; and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20. The grooves 30 are more preferably formed to be flush with the distal ends 34 of the lead electrode 20.

Abstract: The semiconductor device 1 comprises a housing 12 which has a recess 24 in the front surface 1; a pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12, and are bent along the bottom surface 16 of the housing 12; and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20. The grooves 30 are more preferably formed to be flush with the distal ends 34 of the lead electrode 20.

Abstract: The present invention provides a semiconductor device having a structure which is suitable for reduction in thickness and weight. The semiconductor device 1 comprises a housing 12 which has the recess 24 in the front surface 14, the pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12 and are bent along the bottom surface 16 of the housing 12, and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has the grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20.

Abstract: A light emitting device includes a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package. The package has, on the bottom face, two side face convex components provided on the side face sides and a center convex component provided at a center. The outer lead electrodes are housed in a concave components defined by the side face convex components and the center convex component. The side face convex component has groove provided on the side face.

Abstract: To provide a light emitting device that is compact and has high efficiency of extracting light comprising a support body that incorporates a light emitting element. The light emitting device has the protective element 106 mounted on the electrically conductive member 103a and the base 105 mounted on the electrically conductive member 103a, while at least part of the protective element 106 is covered with the base 105, and the light emitting element 104 is mounted on the top surface of the base 105.

Abstract: A light emitting device, comprises: a light emitting element; a plurality of lead frames electrically connected to the light emitting element; and a package that extends in the lengthwise direction, has an opening in its front face for taking out light from the light emitting element, and makes one end of the lead frames to protrude to the outside thereof and sandwiches at least a part thereof, wherein the package has cut-outs in part of its outer surface on both sides in the lengthwise direction of the opening on the front face side, and the width of the cut-outs in the lengthwise direction increases from the rear face side toward the front face side, and the depth from the top face side toward the bottom face side increases from the rear face side toward the front face side.

Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.

Abstract: A light emitting device comprises: a light emitting element; a plurality of lead frames to which the light emitting element is electrically connected; and a package that includes in its interior at least part of said lead frames which protrude outward at one end, that is equipped with an opening for taking off light from the light emitting element, and that extends in the lengthwise direction, wherein a concave portion is formed in the outer surface of at least part of the package wall, the lead frames protruding outward from the package are accommodated in this concave portion, and the walls that constitute said opening and are across from each other in the widthwise direction of the package comprise at least a first wall that is across from the light emitting element, a second wall that is raised up by a step from the first wall, and a third wall that links the first wall and the second wall, and the second wall and third wall are formed thicker than the first wall.

Abstract: A light emitting device, comprises: a light emitting element; a plurality of lead frames electrically connected to the light emitting element; and a package that extends in the lengthwise direction, has an opening in its front face for taking out light from the light emitting element, and makes one end of the lead frames to protrude to the outside thereof and sandwiches at least a part thereof, wherein the package has cut-outs in part of its outer surface on both sides in the lengthwise direction of the opening on the front face side, and the width of the cut-outs in the lengthwise direction increases from the rear face side toward the front face side, and the depth from the top face side toward the bottom face side increases from the rear face side toward the front face side.

Abstract: The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area.

Abstract: A light emitting device comprises: a light emitting element; a plurality of lead frames to which the light emitting element is electrically connected; and a package that includes in its interior at least part of said lead frames which protrude outward at one end, that is equipped with an opening for taking off light from the light emitting element, and that extends in the lengthwise direction, wherein a concave portion is formed in the outer surface of at least part of the package wall, the lead frames protruding outward from the package are accommodated in this concave portion, and the walls that constitute said opening and are across from each other in the widthwise direction of the package comprise at least a first wall that is across from the light emitting element, a second wall that is raised up by a step from the first wall, and a third wall that links the first wall and the second wall, and the second wall and third wall are formed thicker than the first wall.

Abstract: The present invention provides a semiconductor device having a structure which is suitable for reduction in thickness and weight. The semiconductor device 1 comprises a housing 12 which has the recess 24 in the front surface 14, the pair of lead electrodes 20 which have the distal ends 34 exposed in the recess 24, protrude from the external surface of the housing 12 and are bent along the bottom surface 16 of the housing 12, and a semiconductor element 36 which is housed in the recess 24 and is electrically connected to the pair of lead electrodes 20. The housing 12 has the grooves 30 which are formed on the pair of side surfaces 18 which adjoin the front surface 14 and the bottom surface 16 on the right and left sides so as to penetrate the housing 12 from the top surface 28 toward the bottom surface 16 of the housing 12. The grooves 30 preferably have width substantially equal to the thickness of the lead electrode 20.