Patents by Inventor Saiyashwanth Momula

Saiyashwanth Momula has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Automatic deskew using design files or inspection images
    Patent number: 10204416
    Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: February 12, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Arpit Jain, Arpit Yati, Thirupurasundari Jayaraman, Raghavan Konuru, Raj Kuppa, Hema Prasad, Saiyashwanth Momula, Arun Lobo
  • AUTOMATIC DESKEW USING DESIGN FILES OR INSPECTION IMAGES
    Publication number: 20170228866
    Abstract: Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.
    Type: Application
    Filed: September 7, 2016
    Publication date: August 10, 2017
    Inventors: Arpit Jain, Arpit Yati, Thirupurasundari Jayaraman, Raghavan Konuru, Raj Kuppa, Hema Prasad, Saiyashwanth Momula, Arun Lobo