Abstract: Embodiments of the present disclosure herein include an apparatus for processing a substrate. More specifically, embodiments of this disclosure provide a substrate support assembly that includes an electrostatic chuck (ESC) assembly. The ESC assembly comprises a cooling base having a top surface and an outer diameter sidewall, an ESC having a substrate support surface, a bottom surface and an outer diameter sidewall, the bottom surface of the ESC coupled to the top surface of the cooling base by a metal bond layer. The substrate support assembly includes a blocking ring disposed around the metal bond layer.

Abstract: Embodiments of electrostatic chucks (ESCs) are provided herein. In some embodiments, an electrostatic chuck includes: a dielectric plate having an upper surface and a plurality of mesas extending from the upper surface to a first height to at least partially define a support surface for the substrate; four backside gas cooling zones disposed in the dielectric plate; four gas channels disposed in the dielectric plate and corresponding to the four backside gas cooling zones, wherein the four gas channels are fluidly independent within the dielectric plate and extend from a lower surface of the dielectric plate to a plurality of cooling gas outlets extending to the upper surface within each corresponding cooling zone; a plurality of seal rings extending from the upper surface of the dielectric plate to the first height and defining the four backside gas cooling zones; and one or more electrodes disposed in the dielectric plate.

Abstract: A device for measuring a plurality of material properties includes a structure and sensors in the structure configured to sense at least thermal conductivity, electrical conductivity, and Seebeck coefficient for a single sample consecutively while maintaining a vacuum or inert gas environment. Embodiments can also measure ionic conductivity and/or surface temperatures. Embodiments can measure any suitable plurality of the above properties.

Abstract: A device for measuring a plurality of material properties includes a structure and sensors in the structure configured to sense at least thermal conductivity, electrical conductivity, and Seebeck coefficient for a single sample consecutively while maintaining a vacuum or inert gas environment. Embodiments can also measure ionic conductivity and/or surface temperatures. Embodiments can measure any suitable plurality of the above properties.