Abstract: A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond.

Abstract: A resin has a structure defined by Formula (I) wherein: (a) each R5 is independently a methylene group (CH2), or a methylene group substituted with one or more —H, —CH3, or halogen functionalities; (b) each R6 is independently a bond or a straight-chain or branched, linear or cyclic, saturated or unsaturated, substituted or unsubstituted, aliphatic or aromatic group having between 1 and 2 carbon atoms; (c) each X is independently a functionality possessing at least one non-aromatic alkene or alkyne moiety; (d) each Z is independently either H or X; (e) each Z is independently either H or X, and each p is independently an integer from 1-4; (f) each w is independently 0, or an integer greater than or equal to 1, and (i) when w is 0, the bracket region represents a bond and n is 0, or an integer greater than or equal to 1; and (ii) when n is 0, the bracket region represents a bond.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: The present disclosure is directed to resins and to polymers, copolymers, and blends formed therefrom.

Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.

Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150C.

Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1-f-W]n?1-[W-(Z)f/(H)1-f-(OCN)f/(R)1-f]n+2, wherein T is a 1, 3, 5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W—(Z)f/(H)1-f—W]n?1—[W—(Z)f/(H)1-f—(OCN)f/(R)1-f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A): H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract: A ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1?f-W]n?1-[W-(Z)f/(H)1?f-(OCN)f/(R)1?f]n+2, wherein T is a 1,3,5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.