Patents by Inventor Sakae Kitajyo

Sakae Kitajyo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied thereto
    Publication number: 20020056922
    Abstract: A metal layer is formed on each surface of topside substrate electrodes on a substrate. Another metal layer is formed on each surface of chip electrodes on a function element chip. Both ends of vertical coil springs are connected to the topside substrate electrodes and the chip electrodes through the metal layers, respectively. In this way, the topside substrate electrodes are connected to the chip electrodes through the vertical coil springs by means of flip hip bonding.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 16, 2002
    Applicant: NEC Corporation
    Inventors: Takuo Funaya, Naoji Senba, Nobuaki Takahashi, Sakae Kitajyo, Yuzo Shimada