Abstract: Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

Abstract: Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

Abstract: Provided is a machining technology to obtain a desired machining content while suppressing a possibility of causing a redeposition in a machining surface. The invention is directed to provide an ion milling device which includes an ion source which emits an ion beam, a sample holder which holds a sample, and a sample sliding mechanism which slides the sample holder in a direction including a normal direction of an axis of the ion beam.

Abstract: The present invention relates to adjustment of a mask position by driving an R-axis of an electron microscope in order to adjust the mask position with high accuracy while performing observation by the electron microscope without providing a heat generation source inside the electron microscope. The R-axis originally exists in a sample chamber of the electron microscope, which enables control with high accuracy. The R-axis driving of a sample stage can be substituted by raster rotation, therefore, the mask position can be adjusted with high accuracy while performing observation by the electron microscope according to the present invention.

Abstract: The present invention relates to adjustment of a mask position by driving an R-axis of an electron microscope in order to adjust the mask position with high accuracy while performing observation by the electron microscope without providing a heat generation source inside the electron microscope. The R-axis originally exists in a sample chamber of the electron microscope, which enables control with high accuracy. The R-axis driving of a sample stage can be substituted by raster rotation, therefore, the mask position can be adjusted with high accuracy while performing observation by the electron microscope according to the present invention.

Abstract: The object of the present invention is to provide a microstructure drying treatment method by which a substrate having a microstructure has a fine pattern of less than 30 nm and a large-caliber substrate of 100 mm or more can be dried uniformly and in a short time without generating pattern collapse, and its apparatus and its high pressure vessel. The present invention is a microstructure drying treatment method of introducing a fluid that is gas at normal temperature and pressure and is liquid under high pressure inside a high pressure vessel in which a substrate having a microstructure in a state immersed in or wet with a rinsing liquid in a liquid or supercritical state. The method forms a specific gravity difference between the rinsing liquid and fluid inside the high pressure vessel and collects the rinsing liquid to the upper side or lower side of the high pressure vessel by changing at least one side of the temperature and pressure of the fluid and changing the specific gravity of the fluid.

Abstract: The object of the present invention is to provide a microstructure drying treatment method by which a substrate having a microstructure has a fine pattern of less than 30 nm and a large-caliber substrate of 100 mm or more can be dried uniformly and in a short time without generating pattern collapse, and its apparatus and its high pressure vessel. The present invention is a microstructure drying treatment method of introducing a fluid that is gas at normal temperature and pressure and is liquid under high pressure inside a high pressure vessel in which a substrate having a microstructure in a state immersed in or wet with a rinsing liquid in a liquid or supercritical state. The method forms a specific gravity difference between the rinsing liquid and fluid inside the high pressure vessel and collects the rinsing liquid to the upper side or lower side of the high pressure vessel by changing at least one side of the temperature and pressure of the fluid and changing the specific gravity of the fluid.