Patents by Inventor Saki EGUCHI
Saki EGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10141526Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: GrantFiled: August 31, 2016Date of Patent: November 27, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Patent number: 10079353Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: GrantFiled: November 13, 2017Date of Patent: September 18, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Publication number: 20180076401Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: ApplicationFiled: November 13, 2017Publication date: March 15, 2018Inventors: Tatsuya SAKUISHI, Yutaka UCHIDA, Hiroki ADACHI, Saki EGUCHI, Junpei YANAKA, Kayo KUMAKURA, Seiji YASUMOTO, Kohei YOKOYAMA, Akihiro CHIDA
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Patent number: 9849660Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.Type: GrantFiled: May 26, 2016Date of Patent: December 26, 2017Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Saki Eguchi, Koichi Takeshima, Hiroki Adachi
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Patent number: 9676175Abstract: A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle.Type: GrantFiled: June 16, 2015Date of Patent: June 13, 2017Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hiroki Adachi, Saki Eguchi, Masakatsu Ohno, Junpei Yanaka, Yoshiharu Hirakata
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Publication number: 20170092885Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: ApplicationFiled: August 31, 2016Publication date: March 30, 2017Inventors: Tatsuya SAKUISHI, Yutaka UCHIDA, Hiroki ADACHI, Saki EGUCHI, Junpei YANAKA, Kayo KUMAKURA, Seiji YASUMOTO, Kohei YOKOYAMA, Akihiro CHIDA
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Publication number: 20160347047Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.Type: ApplicationFiled: May 26, 2016Publication date: December 1, 2016Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Saki Eguchi, Koichi TAKESHIMA, Hiroki ADACHI
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Patent number: 9437832Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: GrantFiled: February 13, 2015Date of Patent: September 6, 2016Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Publication number: 20150367622Abstract: A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle.Type: ApplicationFiled: June 16, 2015Publication date: December 24, 2015Inventors: Hiroki ADACHI, Saki EGUCHI, Masakatsu OHNO, Junpei YANAKA, Yoshiharu HIRAKATA
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Publication number: 20150236280Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: ApplicationFiled: February 13, 2015Publication date: August 20, 2015Inventors: Tatsuya SAKUISHI, Yutaka UCHIDA, Hiroki ADACHI, Saki EGUCHI, Junpei YANAKA, Kayo KUMAKURA, Seiji YASUMOTO, Kohei YOKOYAMA, Akihiro CHIDA