Abstract: A method for inspection of multiple features of patterned objects in the manufacture of electrical circuits, the method including performing defect detection on the patterned object, employing an optical defect detection machine (ODDM) and employing the ODDM to measure at least one of spatial coordinates and physical attributes of at least some of the multiple features.

Abstract: A method for inspection of multiple features of patterned objects in the manufacture of electrical circuits, the method including performing defect detection on the patterned object, employing an optical defect detection machine (ODDM) and employing the ODDM to measure at least one of spatial coordinates and physical attributes of at least some of the multiple features.

Abstract: In the system, an illumination source emits light, a first beam splitter directs a portion of the light toward a sample and directs another portion of the light toward a reference surface that reflects the light back to the first beam splitter to be recombined with light reflected by the sample, at least one second beam splitter that directs n portions of the light toward n detectors, each of the n portions of the light having a preset phase shift and n?2, and a processor receives intensities of the n portions of the light. The processor calculates an interferogram envelope based on the intensities measured by the n detectors as the reference surface moves between a plurality of signal collection positions.

Abstract: Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

Abstract: A method for inspection of multiple features of patterned objects in the manufacture of electrical circuits, the method including performing defect detection on the patterned object, employing an optical defect detection machine (ODDM) and employing the ODDM to measure at least one of spatial coordinates and physical attributes of at least some of the multiple features.

Abstract: A system and method of inspecting electrical circuits with multiple optical inputs, including: obtaining first and second image data that are generally spatially coincidental but which each include some image data that is different, modifying one of the images by employing the other image so as to produce an enhanced representation of the electrical circuit, and inspecting the enhanced representation for defects.