Patents by Inventor Saki KOZUMA

Saki KOZUMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer expanding method and wafer expanding apparatus
    Patent number: 11018044
    Abstract: A wafer expanding method increases spacing between adjacent devices formed on a wafer. The method includes preparing an annular jig having a first restricting portion, a second restricting portion, and a curved restricting portion connecting the first restricting portion and the second restricting portion, mounting a ring frame supporting the wafer through an adhesive tape on a cylindrical frame fixing member, next mounting the annular jig on the ring frame, and next fixing the ring frame and the annular jig to the cylindrical frame fixing member, and operating a cylindrical pushing member having an outer circumference corresponding to an outer circumference of the wafer to push up an annular exposed portion of the adhesive tape defined between the wafer and the ring frame and thereby lift the wafer away from the ring frame, thereby expanding the annular exposed portion and increasing the spacing between the adjacent devices.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: May 25, 2021
    Assignee: DISCO CORPORATION
    Inventors: Masaru Nakamura, Saki Kozuma
  • WAFER EXPANDING METHOD AND WAFER EXPANDING APPARATUS
    Publication number: 20200135532
    Abstract: A wafer expanding method increases spacing between adjacent devices formed on a wafer. The method includes preparing an annular jig having a first restricting portion, a second restricting portion, and a curved restricting portion connecting the first restricting portion and the second restricting portion, mounting a ring frame supporting the wafer through an adhesive tape on a cylindrical frame fixing member, next mounting the annular jig on the ring frame, and next fixing the ring frame and the annular jig to the cylindrical frame fixing member, and operating a cylindrical pushing member having an outer circumference corresponding to an outer circumference of the wafer to push up an annular exposed portion of the adhesive tape defined between the wafer and the ring frame and thereby lift the wafer away from the ring frame, thereby expanding the annular exposed portion and increasing the spacing between the adjacent devices.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Masaru NAKAMURA, Saki KOZUMA