Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.

Abstract: The conductive film of the present invention includes a conductive polymer (A) and has a film thickness of 35 nm or less, wherein: a surface resistance of the conductive film is 1×1011 ?/sq. or less, and a standard deviation of current that flows through the conductive film upon application of voltage to the conductive film is 5 or less. The conductor of the present invention has a substrate, and the conductive film provided on at least a part of the surface of the substrate. The resist pattern forming method of the present invention includes a lamination step of forming the conductive film on a surface of a resist layer including a chemically amplified resist, said resist layer formed on one surface of a substrate, and an exposure step of irradiating the substrate with an electron beam according to a pattern on its side on which the conductive film is formed.

Abstract: A conductive composition comprising a conductive polymer (A), a water-soluble polymer (B), and a solvent (C1), wherein: the water-soluble polymer (B) comprises a water-soluble polymer (B11) represented by formula (11), and an amount of a water-soluble polymer (B2) represented by formula (2) as the water-soluble polymer (B) is 0.15% by mass or less, based on a total mass of the conductive composition: wherein R1 denotes a linear or branched alkyl group with 6 to 20 carbon atoms, each of R4 and R5 independently denotes a methyl or ethyl group, R6 denotes a hydrophilic group, R7 denotes a hydrogen atom or a methyl group, Y1 denotes a single bond, —S—, —S(?O)—, —C(?O)—O— or —O—, Z denotes a cyano group or a hydroxy group, each of p1 and q denotes an average number of repetitions, and is a number of from 1 to 50, and m denotes a number of from 1 to 5.