Abstract: An integrated circuit element is disclosed having a memory device; a P-type semiconductor region including a first semiconductor device from a first memory port circuit coupled to the memory device and configured to enable access to the memory device when the first semiconductor device is activated; an N-type semiconductor region including a second semiconductor device from a second memory port circuit coupled to the memory device and configured to enable access to the memory device when the second semiconductor device is activated; and a plurality of signal lines distributed over the P-type and N-type semiconductor regions including a first memory port selection line coupled to allow the first semiconductor device to be activated; a second memory port selection line coupled to allow the second semiconductor device to be activated; and a clock signal line placed between the first memory port selection line and the second memory port selection line.

Abstract: A CMOS device includes a PMOS transistor and an NMOS transistor. The CMOS device further includes a poly interconnect connecting together a drain of the PMOS transistor and a drain of the NMOS transistor. The poly interconnect may be located on an edge of a standard cell including the device. The CMOS device may further include a first interconnect on an MD layer connecting the drain of the PMOS transistor to the poly interconnect, and a second interconnect on the MD layer connecting the drain of the NMOS transistor to the poly interconnect. The PMOS transistor and the NMOS transistor may operate as a CMOS inverter. The CMOS device may be a tristate inverter, and specifically, a tristate inverter within a latch array.

Abstract: An integrated circuit element is disclosed having a memory device; a P-type semiconductor region including a first semiconductor device from a first memory port circuit coupled to the memory device and configured to enable access to the memory device when the first semiconductor device is activated; an N-type semiconductor region including a second semiconductor device from a second memory port circuit coupled to the memory device and configured to enable access to the memory device when the second semiconductor device is activated; and a plurality of signal lines distributed over the P-type and N-type semiconductor regions including a first memory port selection line coupled to allow the first semiconductor device to be activated; a second memory port selection line coupled to allow the second semiconductor device to be activated; and a clock signal line placed between the first memory port selection line and the second memory port selection line.