Abstract: An electroplating plant for the electrolyte deposition of metals on flat components such as printed circuit boards and the like, oriented parallel to the direction of feed and continuously supplied via a system for the transmission and supply of cathode current to the boards. The apparatus has at least one pair of electrolytic cells. Each of the cells is provided with a feed aperture and the aperture for the outflow of the electrolytic solution supplied continuously by a pump drawing the same from a recovery tank. Each cell is provided with anodes and a passage for regulating the flow the electrolytic solution. Each cell has its outflow aperture located opposite that of another cell in order to provide an empty space through which the board passes; the board to be thus placed in contact with the electrolytic solution.

Abstract: The present invention relates to a machine for the continuous gold-plating of contact tabs for printed circuit boards which comprises a plurality of cells aligned in sequence which perform the operations of stripping, nickel-plating and gold-plating, and also intermediate operations of rinsing and neutralization, and through which cells said printed circuit boards are conveyed by a double conveyor belt which also effects the cathodic electrical contact for each cells. The said cells are provided with one or more feed chambers and at least one collection tank, provision being made for a chemical or electrochemical bath cascade flow area between said feed chamber or chambers and said collection tank or tanks. Losses from the chemical or electrochemical baths are prevented by recovery chambers placed at the inlet and outlet of each cell.