Patents by Inventor Salkumar Jayaraman

Salkumar Jayaraman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Phase change material containing fusible particles as thermally conductive filler
    Patent number: 7960019
    Abstract: An electronic assembly having a microelectronic die, a heat spreader and a heat sink. A first thermal interface material is disposed between the microelectronic die and the heat spreader. A second thermal interface material is disposed between the heat spreader and a heat sink. The first and second interface materials each comprising a phase change polymer, a solderable material and a plurality of thermally conductive non-fusible particles. The solderable material interconnecting the non-fusible particles to form a plurality of columnar structures within the phase change polymer.
    Type: Grant
    Filed: August 15, 2007
    Date of Patent: June 14, 2011
    Assignee: Intel Corporation
    Inventors: Salkumar Jayaraman, Paul A. Koning, Ashay Dani