Patents by Inventor Sally Foong Yin Lye

Sally Foong Yin Lye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE HAVING MULTIPLE WIRE BONDS FOR A BOND AREA AND METHODS THEREOF
    Publication number: 20130134578
    Abstract: Wire bonds are formed at an integrated circuit device so that multiple wires are bonded to a single bond pad. In a particular embodiment, the multiple wires are bonded by first applying a stud bump to the pad and successively bonding each of the wires to the stud bump. Another stud bump can be placed over the bonded wires to provide additional connection security.
    Type: Application
    Filed: November 29, 2011
    Publication date: May 30, 2013
    Applicant: SPANSION LLC
    Inventors: Gin Ghee Tan, Lai Beng Teoh, Royce Yeoh Kao Tziat, Sally Foong Yin Lye