Patents by Inventor Salman Saed

Salman Saed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flow sensing device and packaging thereof
    Patent number: 8677818
    Abstract: There is described a flow sensing device having a semiconductor chip with a flow channel integrated therein and a sensing element positioned in the flow channel, and a package base attached to the semiconductor chip and allowing access to the two passage-openings of the flow channel from opposite sides of the package base.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: March 25, 2014
    Assignee: Sensortechnics GmbH
    Inventors: Leslie M. Landsberger, Oleg Grudin, Salman Saed, Gennadiy Frolov
  • PASSIVE RESISTIVE-HEATER ADDRESSING NETWORK
    Publication number: 20120176180
    Abstract: There is described a passive heater-and-diode multiplexing network for selective addressing of thermally-coupled and electrically-disconnected fuses within a passive device network (resistor/capacitor/inductor) or within an application circuit.
    Type: Application
    Filed: March 4, 2010
    Publication date: July 12, 2012
    Inventors: Salman Saed, Oleg Grudin, Leslie M. Landsberger, Gennadiy Frolov, Tommy Tsang, Zhen-grong Huang
  • Multi-structure thermally trimmable resistors
    Patent number: 8111128
    Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
    Type: Grant
    Filed: February 6, 2008
    Date of Patent: February 7, 2012
    Assignee: Sensortechnics GmbH
    Inventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston
  • MULTI-STRUCTURE THERMALLY TRIMMABLE RESISTORS
    Publication number: 20100073121
    Abstract: A method for arranging a plurality of thermally isolated microstructures over at least one cavity, each of the microstructures housing at least part of a thermally-trimmable resistor, the thermally-trimmable resistor having at least a functional resistor, the method comprising: providing pairs of facing microstructures; grouping together sets of pairs of facing microstructures, each of the sets having at least one pair of facing microstructures; and arranging microstructures within a given set to have each microstructure exposed to heat from a same number of facing, side, and diagonal neighbors of microstructures from a same resistor.
    Type: Application
    Filed: February 6, 2008
    Publication date: March 25, 2010
    Applicant: MICROBRIDGE TECHNOLOGIES INC.
    Inventors: Oleg Grudin, Salman Saed, Tommy Tsang, Bowei Zhang, Leslie M. Landsberger, L. Richard Williston