Abstract: The invention concerns a layered structure comprising at least two material layers. The layered structure is formed of a conductive polymer on a substrate material layer to allow a reaction in the conductive polymer material when the layered structure is exposed to the surrounding conditions. The invention also concerns a method for producing layered structure. In the method the conductive polymer material is applied on the substrate material by printing or spraying or stamping or casting or spin coating or by using photolithographic or laser ablation method or a combination of these. The invention further concerns a sensor comprising an electric device short circuited by the conductive polymer of the layered structure. In the sensor a change in the conductive polymer initiates a change in the function of the electric device.

Abstract: The invention concerns a layered structure comprising at least two material layers. The layered structure is formed of a conductive polymer on a substrate material layer to allow a reaction in the conductive polymer material when the layered structure is exposed to the surrounding conditions. The invention also concerns a method for producing layered structure. In the method the conductive polymer material is applied on the substrate material by printing or spraying or stamping or casting or spin coating or by using photolithographic or laser ablation method or a combination of these. The invention further concerns a sensor comprising an electric device short circuited by the conductive polymer of the layered structure. In the sensor a change in the conductive polymer initiates a change in the function of the electric device.

Abstract: The invention relates to a method and an arrangement for shielding an electronic means (40, 41) against external electromagnetic interference on one hand, and preventing the electronic means from interfering with closeby electric devices on the other hand. According to the invention, a shielding film (42, 43) with one or more layers is formed comprising one or more intrinsically conductive polymer films (43) and one or more insulating films (42). The shielding film (42, 43) so formed is attached to the surface of the electronic means (40, 41) using a heat treatment or a vacuum treatment or the combination of the two and, if necessary, a separate layer of glue. The invention also relates to a method for electrically connecting (44, 45, 46, 47) the intrinsic polymer layer (43) reliably to the electronic means (40, 41). The invention further relates to a method for using the electromagnetic shield to form capacitors and resistors for the electronic means.