Patents by Inventor Salvatore Bonafede
Salvatore Bonafede has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20180096964Abstract: A method of making a micro-transfer printed structure includes providing a destination substrate and a source substrate having one or more micro-transfer printable components. A layer of volatile adhesive is formed over the destination substrate and one or more components are micro-transfer printed from the source substrate onto the volatile adhesive layer at a non-evaporable temperature of the volatile adhesive layer. The volatile adhesive layer is then heated to an evaporation temperature to evaporate at least a portion of the volatile adhesive after micro-transfer printing. In certain embodiments, a micro-transfer printed structure includes a destination substrate having one or more metal contacts and one or more micro-transfer printable components having one or more component contacts disposed on the destination substrate with the metal contact aligned with the component contact. The metal contact can form an intermetallic bond with the component contact.Type: ApplicationFiled: September 28, 2017Publication date: April 5, 2018Inventors: Salvatore Bonafede, Matthew Meitl, Ronald S. Cok
-
Publication number: 20180001614Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.Type: ApplicationFiled: September 15, 2017Publication date: January 4, 2018Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
-
Publication number: 20180006186Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: ApplicationFiled: September 15, 2017Publication date: January 4, 2018Inventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede
-
Patent number: 9799794Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: GrantFiled: March 31, 2017Date of Patent: October 24, 2017Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Jr., Salvatore Bonafede
-
Publication number: 20170256522Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.Type: ApplicationFiled: March 10, 2017Publication date: September 7, 2017Inventors: Ronald S. Cok, Christopher Andrew Bower, Matthew Meitl, Carl Ray Prevatte, JR., Salvatore Bonafede, Robert R. Rotzoll
-
Publication number: 20170207193Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed. In yet another aspect, a method and structure for heat-assisted micro-transfer printing is disclosed.Type: ApplicationFiled: January 27, 2017Publication date: July 20, 2017Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Ronald S. Cok
-
Publication number: 20170207364Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: ApplicationFiled: March 31, 2017Publication date: July 20, 2017Inventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, JR., Salvatore Bonafede
-
Patent number: 9705042Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: August 2, 2016Date of Patent: July 11, 2017Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Patent number: 9698308Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: June 18, 2015Date of Patent: July 4, 2017Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Patent number: 9640715Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: GrantFiled: May 15, 2015Date of Patent: May 2, 2017Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede
-
Publication number: 20170103964Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.Type: ApplicationFiled: December 21, 2016Publication date: April 13, 2017Inventors: Christopher Andrew Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
-
Patent number: 9550353Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.Type: GrantFiled: July 20, 2015Date of Patent: January 24, 2017Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
-
Patent number: 9520537Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: June 18, 2015Date of Patent: December 13, 2016Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Publication number: 20160343772Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: ApplicationFiled: August 2, 2016Publication date: November 24, 2016Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Publication number: 20160336488Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.Type: ApplicationFiled: May 15, 2015Publication date: November 17, 2016Inventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede
-
Patent number: 9444015Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: June 18, 2015Date of Patent: September 13, 2016Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Patent number: 9434150Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.Type: GrantFiled: July 20, 2015Date of Patent: September 6, 2016Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
-
Patent number: 9437782Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.Type: GrantFiled: June 18, 2015Date of Patent: September 6, 2016Assignee: X-Celeprint LimitedInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
-
Patent number: 9358775Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.Type: GrantFiled: July 20, 2015Date of Patent: June 7, 2016Assignee: X-CELEPRINT LIMITEDInventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
-
Patent number: 9355854Abstract: A method of fabricating transferable semiconductor devices includes providing a release layer including indium aluminum phosphide on a substrate, and providing a support layer on the release layer. The support layer and the substrate include respective materials, such as arsenide-based materials, such that the release layer has an etching selectivity relative to the support layer and the substrate. At least one device layer is provided on the support layer. The release layer is selectively etched without substantially etching the support layer and the substrate. Related structures and methods are also discussed.Type: GrantFiled: August 4, 2011Date of Patent: May 31, 2016Assignee: Semprius, Inc.Inventors: Matthew Meitl, Christopher Bower, Etienne Menard, James Carter, Allen Gray, Salvatore Bonafede