Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: One illustrative vertical transistor device disclosed herein includes a channel region comprising at least one layer of a two-dimensional (2D) material, a bottom source/drain region, a top source/drain region and a gate structure positioned all around at least the at least one layer of a two-dimensional (2D) material.

Abstract: One illustrative device disclosed herein includes a bottom source/drain region and a top source/drain region positioned vertically above at least a portion of the bottom source/drain region, wherein each of the bottom source/drain region and the top source/drain region comprise at least one layer of a two-dimensional (2D) material. The device also includes a substantially vertically oriented semiconductor structure positioned vertically between the bottom source/drain region and the top source/drain region and a gate structure positioned all around an outer perimeter of the substantially vertically oriented semiconductor structure for at least a portion of the vertical height of the substantially vertically oriented semiconductor structure.

Abstract: One illustrative vertical transistor device disclosed herein includes a channel region comprising at least one layer of a two-dimensional (2D) material, a bottom source/drain region, a top source/drain region and a gate structure positioned all around at least the at least one layer of a two-dimensional (2D) material.

Abstract: One illustrative device disclosed herein includes a bottom source/drain region and a top source/drain region positioned vertically above at least a portion of the bottom source/drain region, wherein each of the bottom source/drain region and the top source/drain region comprise at least one layer of a two-dimensional (2D) material. The device also includes a substantially vertically oriented semiconductor structure positioned vertically between the bottom source/drain region and the top source/drain region and a gate structure positioned all around an outer perimeter of the substantially vertically oriented semiconductor structure for at least a portion of the vertical height of the substantially vertically oriented semiconductor structure.

Abstract: A planar transistor device is disclosed including a gate structure positioned above a semiconductor substrate, the semiconductor substrate comprising a substantially planar upper surface, a channel region, a source region, a drain region, and at least one layer of a two-dimensional (2D) material that is positioned in at least one of the source region, the drain region or the channel region, wherein the layer of 2D material has a substantially planar upper surface, a substantially planar bottom surface and a substantially uniform vertical thickness across an entire length of the layer of 2D material in the gate length direction and across an entire width of the layer of 2D material in the gate width direction, wherein the substantially planar upper surface and the substantially planar bottom surface of the layer of 2D material are positioned approximately parallel to a substantially planar surface of the semiconductor substrate.

Abstract: One illustrative embodiment disclosed herein relates to a semiconductor device that includes, among other things, a semiconductor substrate including a base semiconductor layer, an active semiconductor layer, and a buried insulating layer positioned between the base semiconductor layer and the active semiconductor layer. The device further includes a set of functional gate structures including at least one functional gate structure formed above the active semiconductor layer, a first source/drain region positioned in the active semiconductor layer adjacent a first functional gate structure in the set, a first auxiliary gate structure positioned adjacent the first source/drain region, and a discharge device coupled to the base semiconductor layer and the first auxiliary gate structure.

Abstract: At least one method, apparatus and system disclosed herein involves forming a device comprising a transistor comprising an active gate and at least one inactive gate in parallel to the active gate. A source region on a substrate is formed. An active gate region is formed on the substrate adjacent the source region. A drain region is formed on the substrate adjacent the active gate region. A first inactive gate region is formed on the substrate in parallel to the active gate region. The source region, the drain region, the active gate region, and the first inactive gate region comprise the transistor. The first inactive gate region is capable of dissipating the at least a portion of a charge.

Abstract: At least one method, apparatus and system disclosed herein involves forming a device comprising a transistor comprising an active gate and at least one inactive gate in parallel to the active gate. A source region on a substrate is formed. An active gate region is formed on the substrate adjacent the source region. A drain region is formed on the substrate adjacent the active gate region. A first inactive gate region is formed on the substrate in parallel to the active gate region. The source region, the drain region, the active gate region, and the first inactive gate region comprise the transistor. The first inactive gate region is capable of dissipating the at least a portion of a charge.

Abstract: At least one method, apparatus and system disclosed herein involves forming a device comprising a transistor comprising an active gate and at least one inactive gate in parallel to the active gate. A source region on a substrate is formed. An active gate region is formed on the substrate adjacent the source region. A drain region is formed on the substrate adjacent the active gate region. A first inactive gate region is formed on the substrate in parallel to the active gate region. The source region, the drain region, the active gate region, and the first inactive gate region comprise the transistor. The first inactive gate region is capable of dissipating the at least a portion of a charge.

Abstract: An orthotic device that minimizes weight bearing on certain areas of a shoe being worn by a diabetic suffering from a diabetic foot ulcer, the device allows patients to live active lifestyles while being treated for diabetic foot ulcerations. The orthotic device purposely establishes three points of contact between the device and a shoe. The present device is used in conjunction with a shoe having a sole that defines a cutaway wherein an ulcerous foot wound would lie. The orthotic device comprises a shoe cartridge, the shoe cartridge has a first, second and third section, each section has a left and a right side, at least five L-shaped docks attached to the shoe cartridge, a support attached to the shoe cartridge, and at least five securing means, each securing means is attached to each L-shaped dock.

Abstract: An orthotic device that minimizes weight bearing on certain areas of a shoe being worn by a diabetic suffering from a diabetic foot ulcer, the device allows patients to live active lifestyles while being treated for diabetic foot ulcerations. The orthotic device purposely establishes three points of contact between the device and a shoe. The present device is used in conjunction with a shoe having a sole that defines a cutaway wherein an ulcerous foot wound would lie. The orthotic device comprises a shoe cartridge, the shoe cartridge has a first, second and third section, each section has a left and a right side, at least five L-shaped docks attached to the shoe cartridge, a support attached to the shoe cartridge, and at least five securing means, each securing means is attached to each L-shaped dock.