Patents by Inventor Salvatore Latino

Salvatore Latino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding pad structure over active circuitry
    Patent number: 9922947
    Abstract: Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: March 20, 2018
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Dario Vitello, Federico Frego, Salvatore Latino
  • BONDING PAD STRUCTURE OVER ACTIVE CIRCUITRY
    Publication number: 20170317039
    Abstract: Various embodiments provide a bonding pad structure that is capable of handling increased bonding loads. In one embodiment, the bonding pad structure includes a continuous metal layer, a first discontinuous metal layer, a second discontinuous metal layer, and dielectric material. The first discontinuous metal layer and the second discontinuous metal layer each include a plurality of holes that are arranged in a pattern. The plurality of holes of the first discontinuous metal layer overlaps at least two of the plurality of holes of the second discontinuous metal layer. The dielectric material is formed between the metal layers and fills the plurality of holes of the first and second discontinuous metal layers.
    Type: Application
    Filed: April 28, 2016
    Publication date: November 2, 2017
    Inventors: Dario Vitello, Federico Frego, Salvatore Latino