Abstract: This patent discloses apparatus for retaining a semiconductor wafer in a predetermined position or orientation to permit dicing of the wafer into discrete semiconductor chips of a predetermined size without dislocation of the chips during the dicing operation, the chips being arranged in columns and rows with a kerf area intermediate adjacent chips. The apparatus comprises a base member having a semicondcutor wafer positioning area with a connection to the base member for applying the vacuum to a plurality of spaced apart apertures in the wafer receiving area, the apertures corresponding to the location of the chips.