Patents by Inventor Sam Andreades

Sam Andreades has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of photosensitive stratum to create through-hole connections in circuit boards
    Patent number: 4360570
    Abstract: Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.
    Type: Grant
    Filed: June 15, 1981
    Date of Patent: November 23, 1982
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Sam Andreades, Grant A. Beske, John W. Lott
  • Use of photosensitive stratum to create through-hole connections in circuit boards
    Patent number: 4283243
    Abstract: Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.
    Type: Grant
    Filed: March 20, 1980
    Date of Patent: August 11, 1981
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Sam Andreades, Grant A. Beske, John W. Lott
  • Perfluoralkylcyanocyclopropenes
    Patent number: 3968137
    Abstract: Described are random linear copolymers of certain cyclopropenes, e.g., cyclopropene or 1-methylcyclopropene, with certain ethylenically unsaturated or strained ring monomers, e.g., ethylene, acrylonitrile, 2-chlorobutadiene or 1-cyanobicyclo[1.1.0]butane. Prepared by direct interaction between the monomers, the copolymers are useful film- and fiber-formers.
    Type: Grant
    Filed: May 28, 1975
    Date of Patent: July 6, 1976
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Sam Andreades, Richard L. Baird